公开(公告)号：EP4071554A1

公开(公告)日：2022-10-12

申请号：EP21167479.1

申请日：2021-04-08

Applicant: ASML Netherlands B.V.

Inventor： KARA, Dogacan ,  WILDENBERG, Jochem Sebastiaan ,  DECKERS, David Frans Simon ,  YUDHISTIRA, Yasri ,  HILHORST, Gijs ,  CAICEDO FERNANDEZ, David Ricardo ,  SPIERING, Frans Reinier ,  KHO, Sinatra Canggih ,  BLOM, Herman Martin ,  KIM, Sang-Uk ,  KIM, Hyun Su

IPC: G03F7/20 ,  G03F9/00

Abstract: Disclosed is a method for modeling measurement data relating to a parameter of interest over at least two substrate portions of a substrate and associated apparatuses. The method comprises obtaining at least a first substrate portion model for describing the parameter of interest across one or more first substrate portions on the substrate and a second substrate portion model for describing the parameter of interest across one or more second substrate portions on the substrate; and performing steps 1 to 4 iteratively for each of said plurality of substrate portion models until a stopping criterion is met. These steps comprise 1. selecting a candidate basis function from a plurality of candidate basis functions; 2. updating the substrate portion model by adding the candidate basis function into the substrate portion model; 3. evaluating the updated substrate portion model using the measurement data; and 4. determining whether to include the basis function within the substrate portion model based on the evaluation.

公开(公告)号：EP3382606A1

公开(公告)日：2018-10-03

申请号：EP17163147.6

申请日：2017-03-27

Applicant: ASML Netherlands B.V.

Inventor： NIJE, Jelle ,  YPMA, Alexander ,  GKOROU, Dimitra ,  TSIROGIANNIS, Georgios ,  VAN WIJK, Robert Jan ,  CHEN, Tzu-Chao ,  SPIERING, Frans Reinier

IPC: G06K9/62 ,  G03F7/20

CPC classification number: G06K9/6247 ,  G03F7/70616 ,  G03F7/70633

Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method comprising: (a) receiving object data 210, 230 representing one or more parameters measured 206, 208 across wafers 204, 224 and associated with different stages of processing of the wafers; (b) determining fingerprints 213, 234 of variation of the object data across the wafers, the fingerprints being associated with different respective stages of processing of the wafers. The fingerprints may be determined by decomposing 212, 232 the object data into components using principal component analysis for each different respective stage; (c) analyzing 246 commonality of the fingerprints through the different stages to produce commonality results; and (d) optimizing 250-258 an apparatus for processing 262 product units based on the commonality results.

公开(公告)号：EP3809203A1

公开(公告)日：2021-04-21

申请号：EP19203752.1

申请日：2019-10-17

Applicant: ASML Netherlands B.V.

Inventor： KEYVANI JANBAHAN, Aliasghar ,  SPIERING, Frans Reinier ,  WILDENBERG, Jochem Sebastiaan

IPC: G03F7/20 ,  G06K9/62

Abstract: Disclosed is a method of fitting measurement data to a model. The method comprises obtaining measurement data relating to a performance parameter for at least a portion of a substrate; and fitting the measurement data to the model by minimizing a complexity metric applied to fitting parameters of the model while not allowing the deviation between the measurement data and the fitted model to exceed a threshold value.