公开(公告)号：US20040024127A1

公开(公告)日：2004-02-05

申请号：US10373201

申请日：2003-02-26

Applicant: ATOFINA

Inventor： Martin Baumert ,  Francois Court ,  Christian Laurichesse

IPC: C08G061/00

CPC classification number: C09J151/06 ,  C08G81/028 ,  C08L51/00 ,  C08L51/06 ,  C08L77/00 ,  C08L93/00 ,  C08L2205/08 ,  C08L2666/02 ,  C08L2666/04 ,  C08L2666/14 ,  C09J123/02 ,  C09J193/00

Abstract: The present invention relates to a hot-melt adhesive composition comprising: 20 to 80% of a blend comprising: 50 to 100% of (A), which denotes a polyamide-block graft copolymer consisting of a polyolefin backbone and at least one polyamide graft, 0 to 50% of at least one polymer (B) chosen from polyolefins and polyamides; 80 to 20% of a blend comprising at least one tackifying resin and optionally at least one product chosen from waxes, plasticizers and mineral fillers; in which: the said graft is attached to the backbone via the residues of an unsaturated monomer (X) chosen from unsaturated carboxylic acids, anhydrides of unsaturated carboxylic acids and unsaturated epoxides; the residues of the unsaturated monomer (X) are attached to the backbone by grafting or copolymerization from its double bond; the molar mass {overscore (M)}n of the grafts is between 1000 and 5000; the melting point of the grafts is between 100 and 190null C.; and the MFI of (A) is between 1 and 500 (g/10 min at 190null C. under a load of 2.16 kg). This composition has many advantages: it is processed at the usual temperatures for hot-melt adhesives, that is to say around 180null C.; it is not necessary, after application, to wait for crosslinking; it is simpler to use than two-component adhesives such as epoxy adhesives in which a hardener is necessary; and it has a markedly improved shear adhesive failure temperature (SAFT) compared with crosslinkable hot-melt adhesives.

Abstract translation: 本发明涉及一种热熔粘合剂组合物，其包含：20至80％的共混物，其包含：50至100％的（A），其表示由聚烯烃主链和至少一个聚酰胺接枝物组成的聚酰胺嵌段接枝共聚物 ，0至50％的至少一种选自聚烯烃和聚酰胺的聚合物（B）; 80至20％的包含至少一种增粘树脂和任选的至少一种选自蜡，增塑剂和矿物填料的产品的共混物; 其中：所述接枝通过选自不饱和羧酸，不饱和羧酸的酸酐和不饱和环氧化物的不饱和单体（X）的残基连接到主链上; 不饱和单体（X）的残基通过其双键的接枝或共聚连接到主链上; 摩擦质量（超芯（移植物的Mn在1000和5000之间;移植物的熔点在100和190℃之间）;（A）的MFI在1和500之间（190 / g / 10分钟 该组合物具有许多优点：在通常的温度下对热熔胶进行加工，也就是说在180℃附近;施用后不需要等待 用于交联;其比使用需要硬化剂的环氧粘合剂的双组分粘合剂更简单;与可交联热熔粘合剂相比，其具有显着改善的剪切粘合破坏温度（SAFT）。

公开(公告)号：US20030104150A1

公开(公告)日：2003-06-05

申请号：US09998932

申请日：2001-12-03

Applicant: ATOFINA

Inventor： Anthony Bonnet ,  Francois Court ,  Ludwik Leibler

IPC: B32B001/08 ,  H01C001/00 ,  H01B001/06

CPC classification number: C08L27/16 ,  C08L53/02 ,  Y10S977/753 ,  Y10T428/1352 ,  Y10T428/139 ,  C08L2666/24

Abstract: The present invention relates to a conductive composition comprising (i) a fluoropolymer, (ii) an electrically conductive product and (iii) a triblock copolymer ABC, the three blocks A, B and C being linked together in this order, each block being either a homopolymer or a copolymer obtained from two or more monomers, block A being linked to block B and block B to block C by means of a covalent bond or an intermediate molecule linked to one of these blocks via a covalent bond and to the other block via another covalent bond, and such that: block A is compatible with the fluoropolymer, block B is incompatible with the fluoropolymer and is incompatible with block A, block C is incompatible with the fluoropolymer, block A and block B. The invention also relates to the components manufactured with the above composition. These components may be plates, films, tubes, rods, centrifugal pump components and containers.

Abstract translation: 本发明涉及导电组合物，其包含（i）含氟聚合物，（ii）导电产物和（iii）三嵌段共聚物ABC，三个嵌段A，B和C依次连接在一起，每个嵌段是 由两种或更多种单体获得的均聚物或共聚物，嵌段A通过共价键连接至嵌段B和嵌段B以通过共价键或与其中一个嵌段相连的中间分子与另一嵌段 并且使得：块A与含氟聚合物相容，嵌段B与含氟聚合物不相容并且与嵌段A不相容，嵌段C与氟聚合物，嵌段A和嵌段B不相容。本发明还涉及 用上述成分制造的部件。 这些部件可以是板，膜，管，杆，离心泵部件和容器。