公开(公告)号：WO1998002937A1

公开(公告)日：1998-01-22

申请号：PCT/US1997008562

申请日：1997-05-20

Applicant: AUGAT INC.

Inventor： AUGAT INC. ,  KEMPF, Andrew, J. ,  PERRY, Jason ,  LOCATI, Ronald, P.

IPC: H01R09/09

CPC classification number: H01R24/50 ,  H01R13/18 ,  H01R2103/00

Abstract: A printed circuit board to housing interconnect system (10) capable of withstanding "hot" connects and disconnects of conductors (120, 220) carrying currents of up to 15 amperes or more while maintaining RF performance. The interconnect system may be used to couple power lines or RF signal lines from a printed circuit board to a high power system. The interconnect system allows a printed circuit board to be installed or removed from a system without having to power down the system in order to perform installation or removal.

Abstract translation: 一种印刷电路板到外壳互连系统（10），其能够承受高达15安培或更多电流的导体（120,220）的“热”连接和断开，同时保持RF性能。 互连系统可用于将电力线或RF信号线从印刷电路板耦合到高功率系统。 互连系统允许将印刷电路板从系统安装或移除，而无需关闭系统以进行安装或拆卸。

公开(公告)号：EP0855093A1

公开(公告)日：1998-07-29

申请号：EP97926633.0

申请日：1997-05-20

Applicant: Augat Inc.

Inventor： KEMPF, Andrew, J. ,  PERRY, Jason ,  LOCATI, Ronald, P.

IPC: H01R13

CPC classification number: H01R24/50 ,  H01R13/18 ,  H01R2103/00

Abstract: A printed circuit board to housing interconnect system (10) capable of withstanding 'hot' connects and disconnects of conductors (120, 220) carrying currents of up to 15 amperes or more while maintaining RF performance. The interconnect system may be used to couple power lines or RF signal lines from a printed circuit board to a high power system. The interconnect system allows a printed circuit board to be installed or removed from a system without having to power down the system in order to perform installation or removal.