公开(公告)号：US20020043551A1

公开(公告)日：2002-04-18

申请号：US09885226

申请日：2001-06-20

Applicant: AXSUN Technologies, Inc.

Inventor： Robert L. Payer ,  Livia M. Racz

IPC: B23K001/06 ,  B23K005/20 ,  B23K020/10 ,  B23K035/12

CPC classification number: G02B7/003 ,  G02B6/3636 ,  G02B6/3656 ,  G02B6/3692 ,  G02B6/4226 ,  G02B6/4237 ,  G02B6/4238 ,  G02B6/4239 ,  G02B27/62

Abstract: A micro-optical component comprises an optical element for interacting with an optical beam and a mounting structure for attaching the optical element to an optical bench. This optical element is solid phase welded to the mounting structure. Solid phase welding has advantages in that it can be performed at lower temperatures than most soldering, even some eutectic soldering. Solid-phase welding, however, is much more robust during subsequent temperature cycling. This is especially important when the optical components undergo subsequent high temperature cycling.

Abstract translation: 微光学部件包括用于与光束相互作用的光学元件和用于将光学元件附接到光学平台的安装结构。 该光学元件与固定结构固相焊接。 固相焊接的优点在于它可以在比大多数焊接更低的温度下进行，甚至是一些共晶焊接。 然而，在随后的温度循环中，固相焊接更加坚固。 当光学部件经历随后的高温循环时，这尤其重要。

公开(公告)号：US20040100686A1

公开(公告)日：2004-05-27

申请号：US10392353

申请日：2003-03-19

Applicant: AXSUN Technologies, Inc.

Inventor： Dale C. Flanders ,  Walid Atia ,  Eric E. Fitch ,  Minh Van Le ,  Randal A. Murdza ,  Robert L. Payer ,  Jeffrey A. Korn ,  Xiaomei Wang ,  Walter R. Buchwald ,  L. James Newman III

IPC: H01S003/00

CPC classification number: H01S5/02216 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/0683

Abstract: A detector system for a fiber optic component is insensitive to stray light. Specifically, the invention comprises a detector chip, which converts received light into an electric signal. A baffle substrate is positioned over the detector chip. This baffle substrate has a transmission port through which an optical signal is transmitted to the detector chip. As a result, light that is not directed to be transmitted through the port is blocked by the baffle substrate. In this way, it rejects stray light that may be present in the hermetic package. A detector substrate is provided on which the detector chip is mounted. This detector substrate preferably comprises electrical traces to which the detector chip is electrically connected. The detector substrate can further comprise bond pads for wire bonding to make electrical connections to the electrical traces.

Abstract translation: 用于光纤部件的检测器系统对杂散光不敏感。 具体地，本发明包括将接收的光转换成电信号的检测器芯片。 挡板基板位于检测器芯片上。 该挡板基板具有传输端口，通过该传输端口将光信号传输到检测器芯片。 结果，不被透射通过端口的光被挡板衬底阻挡。 以这种方式，它拒绝可能存在于密封包装中的杂散光。 设置有检测器芯片安装在其上的检测器基板。 该检测器基板优选地包括检测器芯片电连接到的电迹线。 检测器基板还可以包括用于引线键合的接合焊盘以与电迹线进行电连接。

公开(公告)号：US20020190335A1

公开(公告)日：2002-12-19

申请号：US09884844

申请日：2001-06-19

Applicant: AXSUN Technologies, Inc.

Inventor： Robert L. Payer

IPC: H01L023/495 ,  H01L023/52 ,  H01L023/02

CPC classification number: G02B6/4201 ,  G02B6/4248 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An optoelectronic hermetic package comprises a frame defining a hermetic boundary and an electrical feedthrough assembly on the frame. This electrical feedthrough assembly provides electrical connections between signal wire bond areas within the hermetic boundary to electrical contact areas outside the hermetic boundary. Additionally, according to the invention, ground wire bond pad areas are also provided within the hermetic boundary, the ground wire bond pad areas being electrically connected to each other and/or the frame or other ground plane.

Abstract translation: 光电密封封装包括限定密封边界的框架和框架上的电馈通组件。 该电馈通组件提供密封边界内的信号线接合区域与密封边界外部的电接触区域之间的电连接。 此外，根据本发明，接地线接合焊盘区域也设置在密封边界内，地线接合焊盘区域彼此电连接和/或框架或其它接地平面。

公开(公告)号：US20020135894A1

公开(公告)日：2002-09-26

申请号：US10064081

申请日：2002-06-10

Applicant: Axsun Technologies, Inc.

Inventor： Mona Masghati ,  Livia M. Racz ,  Robert L. Payer ,  Dale C. Flanders

IPC: G02B007/02

CPC classification number: G02B6/32 ,  G02B6/327 ,  G02B6/3636 ,  G02B6/3644 ,  G02B6/3656 ,  G02B6/3692 ,  G02B6/4225 ,  G02B6/4226 ,  G02B6/4237 ,  G02B6/4238 ,  G02B6/4244 ,  G02B6/4249 ,  G02B7/003 ,  G02B27/62

Abstract: An optical component is adapted for pick-and-place-style installation on an optical submount or bench and compatible with a chuck of a bonder that picks-up the optical component, places it on the optical bench, and then typically solder bonds the optical component to the bench. In the current implementation, this optical component comprises an optical element, such as an optical fiber, lens, or MOEMS device, that is attached to a plastically deformable mounting structure. The optical component has a bench-attach surface that is used to bond the optical component to an optical bench. Further, the optical component has a bonder chuck engagement surface to which a bonder chuck attaches to manipulate the optical component, such as install it, on the optical bench.