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公开(公告)号:US07932525B2
公开(公告)日:2011-04-26
申请号:US12020401
申请日:2008-01-25
Applicant: Abe Osamu
Inventor: Abe Osamu
CPC classification number: H01L33/486 , H01L25/0753 , H01L25/167 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/8592 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor light-emitting device includes: a light-emitting semiconductor element arranged on a lead frame; a transparent resin mold covering the light-emitting semiconductor element and the lead frame except a terminal portion of the lead frame; and a reflective surface formed on a bent portion of part of the lead frame. The terminal portion of the lead frame has a terminal structure, which can serve as a combination of a top-view type and a side-view type.
Abstract translation: 一种半导体发光器件,包括:布置在引线框上的发光半导体元件; 覆盖所述发光半导体元件和所述引线框架的除了所述引线框架的端子部分之外的透明树脂模具; 以及形成在引线框架的一部分的弯曲部分上的反射表面。 引线框架的端子部分具有端子结构,其可以用作顶视型和侧视型的组合。
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公开(公告)号:US20080296592A1
公开(公告)日:2008-12-04
申请号:US12020401
申请日:2008-01-25
Applicant: Abe Osamu
Inventor: Abe Osamu
IPC: H01L33/00
CPC classification number: H01L33/486 , H01L25/0753 , H01L25/167 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/8592 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor light-emitting device includes: a light-emitting semiconductor element arranged on a lead frame; a transparent resin mold covering the light-emitting semiconductor element and the lead frame except a terminal portion of the lead frame; and a reflective surface formed on a bent portion of part of the lead frame. The terminal portion of the lead frame has a terminal structure, which can serve as a combination of a top-view type and a side-view type.
Abstract translation: 一种半导体发光器件,包括:布置在引线框上的发光半导体元件; 覆盖所述发光半导体元件和所述引线框架的除了所述引线框架的端子部分之外的透明树脂模具; 以及形成在引线框架的一部分的弯曲部分上的反射表面。 引线框架的端子部分具有端子结构,其可以用作顶视型和侧视型的组合。
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