公开(公告)号：US20250069579A1

公开(公告)日：2025-02-27

申请号：US18236221

申请日：2023-08-21

Applicant: Advanced Micro Devices, Inc. ,  XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Christopher JAGGERS ,  Hoa DO ,  Md Malekkul ISLAM ,  Paul Theodore ARTMAN ,  Sukesh SHENOY ,  Suresh RAMALINGAM ,  Muhammad Afiq Bin In BAHAROM

IPC: G10K11/178

Abstract: In one example, a micro device includes a housing; a chip package disposed in the housing; a noise producing component coupled to the housing. The micro device also includes a noise reduction system having a reference microphone for detecting a noise from the noise producing component and a controller configured to receive the noise from the reference microphone and generate a masking sound signal in response to the detected noise. A speaker is coupled to the housing for producing a masking sound corresponding to the masking sound signal, whereby the masking sound reduces the noise. In another example, the noise producing component comprises a fan.

公开(公告)号：US20240314934A1

公开(公告)日：2024-09-19

申请号：US18121487

申请日：2023-03-14

Applicant: Advanced Micro Devices, Inc.

Inventor： Gamal REFAI-AHMED ,  Suresh RAMALINGAM ,  Aslam YEHIA ,  Chi-Yi CHAO ,  Md Malekkul ISLAM ,  Hoa DO

IPC: H05K1/18 ,  H05K5/00 ,  H05K7/10 ,  H05K7/20

CPC classification number: H05K1/181 ,  H05K5/0026 ,  H05K7/10 ,  H05K7/20836

Abstract: An electronic device having a frame for coupling a plurality of thermal management devices to the printed circuit board is provided. The electronic device includes a first chip package mounted to the PCB and a second chip package mounted to the PCB. The frame is secured to the PCB, and the frame has a first aperture disposed over the first chip package and a second aperture disposed over the second chip package. The plurality of thermal management devices coupled to the frame includes a first thermal management device contacting an IC die of the first chip package through the first aperture and a second thermal management device contacting an IC die of the second chip package through the second aperture.

公开(公告)号：US20240290686A1

公开(公告)日：2024-08-29

申请号：US18113585

申请日：2023-02-23

Applicant: Advanced Micro Devices, Inc.

Inventor： Gamal REFAI-AHMED ,  Chi-Yi CHAO ,  Md Malekkul ISLAM ,  Suresh RAMALINGAM ,  Paul Theodore ARTMAN ,  Mark STEINKE ,  Christopher JAGGERS

IPC: H01L23/427 ,  H01L23/367 ,  H01L23/373 ,  H01L23/46

CPC classification number: H01L23/427 ,  H01L23/367 ,  H01L23/3732 ,  H01L23/46

Abstract: A heat exchanger for a chip package is provided. The heat exchanger includes a body having an upper side, a lower side, and an internal cavity disposed in the body between the upper side and the lower side. A first outlet port and a second outlet port are formed in the body and are in fluid communication with the internal cavity. An inlet port is formed through the upper side of the body between the first and second outlet ports to supply fluid into the internal cavity.

公开(公告)号：US20240258190A1

公开(公告)日：2024-08-01

申请号：US18102065

申请日：2023-01-26

Applicant: Advanced Micro Devices, Inc.

Inventor： Gamal REFAI-AHMED ,  Chi-Yi CHAO ,  Christopher JAGGERS ,  Suresh RAMALINGAM ,  Sukesh SHENOY

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H01L23/40 ,  H01L23/427

CPC classification number: H01L23/3675 ,  H01L21/4817 ,  H01L23/4006 ,  H01L23/427 ,  H01L24/29 ,  H01L24/32 ,  H01L2023/4068 ,  H01L2023/4087 ,  H01L24/16 ,  H01L24/33 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/0665

Abstract: A chip package includes a substrate and an integrated circuit (“IC”) die mounted to the substrate. A stiffener frame is mounted to the substrate and circumscribes the IC die. The stiffener frame has a plurality of connected walls that define an opening in the stiffener frame. The chip package also includes a lid having a bottom side facing a top surface of the IC die. The lid has at least a first guide and a second guide extending from the bottom side of the lid. The first guide can be disposed outward or inward of the stiffener frame. The first guide has a side facing an outer wall surface or an inner wall surface of the stiffener frame. The first guide and the second guide are positioned to limit movement of the lid relative to the stiffener frame in two directions.

公开(公告)号：US20230420335A1

公开(公告)日：2023-12-28

申请号：US17851937

申请日：2022-06-28

Applicant: XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Suresh RAMALINGAM

IPC: H01L23/40 ,  H01L25/065 ,  H01L23/498 ,  H01L23/46

CPC classification number: H01L23/4006 ,  H01L25/0655 ,  H01L23/49833 ,  H01L23/46 ,  H01L21/4882

Abstract: Chip packages, electronic devices and method for making the same are described herein. The chip packages and electronic devices have a heat spreader disposed over a plurality of integrated circuit (IC) devices. The heat spreader has an opening through which a protrusion from an overlaying cover extends into contact with one or more of the IC devices to provide a direct heat transfer path to the cover. Another one or more other IC devices have a heat transfer path to the cover through the heat spreader. The separate heat transfer paths allow more effective thermal management of the IC devices of the chip package.

公开(公告)号：US20230253380A1

公开(公告)日：2023-08-10

申请号：US17669252

申请日：2022-02-10

Applicant: XILINX, INC.

Inventor： Li-Sheng WENG ,  Suresh RAMALINGAM ,  Hong SHI

IPC: H01L25/16 ,  H01L23/00

CPC classification number: H01L25/16 ,  H01L24/24 ,  H01L2224/24265 ,  H01L2924/19103 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2224/244 ,  H01L2224/24226

Abstract: A chip package and method for fabricating the same are provided that includes a near-die integrated passive device. The near-die integrated passive device is disposed between a package substrate and an integrated circuit die of a chip package. Some non-exhaustive examples of an integrated passive device that may be disposed between the package substrate and the integrated circuit die include a resistor, a capacitor, an inductor, a coil, a balum, or an impedance matching element, among others.

公开(公告)号：US20210366873A1

公开(公告)日：2021-11-25

申请号：US16880811

申请日：2020-05-21

Applicant: XILINX, INC.

Inventor： Jaspreet Singh GANDHI ,  Suresh RAMALINGAM ,  William E. ALLAIRE ,  Hong SHI ,  Kerry M. PIERCE

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00

Abstract: A chip package assembly and method for fabricating the same are provided that provide a modular chip stack that can be matched with one or more chiplets. The use of chiplets enables the same modular stack to be utilized in a large number of different chip package assembly designs, resulting much faster development times at a fraction of the overall solution cost.

公开(公告)号：US20210134757A1

公开(公告)日：2021-05-06

申请号：US16672802

申请日：2019-11-04

Applicant: XILINX, INC.

Inventor： Jaspreet Singh GANDHI ,  Suresh RAMALINGAM

IPC: H01L25/065 ,  H01L23/00 ,  H01L21/56

Abstract: A chip package assembly and method for fabricating the same are provided which utilize a plurality of posts in mold compound for improved resistance to delamination. In one example, a chip package assembly is provided that includes a first integrated circuit (IC) die, a substrate, a redistribution layer, a mold compound and a plurality of posts. The redistribution layer provides electrical connections between circuitry of the first IC die and circuitry of the substrate. The mold compound is disposed in contact with the first IC die and spaced from the substrate by the redistribution layer. The plurality of posts are disposed in the mold compound and are laterally spaced from the first IC die. The plurality of posts are not electrically connected to the circuitry of the first IC die.

公开(公告)号：US20230282547A1

公开(公告)日：2023-09-07

申请号：US17688803

申请日：2022-03-07

Applicant: XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Yohan FRANS ,  Suresh RAMALINGAM

IPC: H01L23/427 ,  H01L25/16 ,  H01L23/16 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/427 ,  H01L21/4882 ,  H01L23/16 ,  H01L23/562 ,  H01L25/167

Abstract: Chip packages and methods for fabricating the same are provided which utilize a first heat spreader interfaced with a first integrated circuit (IC) die and a second heat spreader separately interfaced with a second IC die. The separate heat spreaders allow the force applied to the first IC die to be controlled independent of the force applied to the second IC die.

公开(公告)号：US20210305127A1

公开(公告)日：2021-09-30

申请号：US16833034

申请日：2020-03-27

Applicant: XILINX, INC.

Inventor： Gamal REFAI-AHMED ,  Suresh RAMALINGAM ,  Ken CHANG ,  Mayank RAJ ,  Chuan XIE ,  Yohan FRANS

IPC: H01L23/473 ,  H01L23/367 ,  H01L25/16

Abstract: Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.