公开(公告)号：US20220128768A1

公开(公告)日：2022-04-28

申请号：US17568510

申请日：2022-01-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Huang-Hsien CHANG ,  Po Ju WU ,  Yu Cheng CHEN ,  Wen-Long LU

IPC: G02B6/36 ,  G02B6/44 ,  G02B6/42

Abstract: An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.