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    Fuse structures, methods of making and using the same, and integrated circuits including the same
    5.
    发明授权
    Fuse structures, methods of making and using the same, and integrated circuits including the same 有权
    保险丝结构，制造和使用它们的方法以及包括其的集成电路

    公开(公告)号：US06940107B1

    公开(公告)日：2005-09-06

    申请号：US10734779

    申请日：2003-12-12

    Applicant: Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    Inventor： Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    IPC: H01L23/525 ,  H01L27/10

    CPC classification number: H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A fuse structure, an integrated circuit including the structure, and methods for making the structure and (re)configuring a circuit using the fuse. The fuse structure generally includes (a) a conductive structure with at least two circuit elements electrically coupled thereto, (b) a dielectric layer over the conductive structure, and (c) a first lens over both the first dielectric layer and the conductive structure configured to at least partially focus light onto the conductive structure. The method of making the structure generally includes the steps of (1) forming a conductive structure electrically coupled to first and second circuit elements, (2) forming a dielectric layer thereover, and (3) forming a lens on or over the dielectric layer and over the conductive structure, the lens being configured to at least partially focus light onto the conductive structure. The method of (re)configuring a circuit generally includes the steps of (i) irradiating at least one lens on or near a surface of the circuit sufficient to electrically disconnect a corresponding first fuse positioned under the lens and disable a first configuration of the circuit, and (ii) irradiating at least one other lens on or near the surface of the circuit sufficient to electrically disconnect a corresponding second fuse positioned under that lens and enable a second configuration of the circuit. The structure and methods advantageously provide fuse structures having improved reliability and smaller chip area, thereby increasing the yield of the manufacturing process and the numbers of die per wafer (both gross and good).

    Abstract translation: 保险丝结构，包括该结构的集成电路，以及使用该保险丝的结构和（重新）配置电路的方法。 熔丝结构通常包括（a）具有至少两个电耦合到其上的电路元件的导电结构，（b）导电结构上的电介质层，和（c）第一介电层和导电结构上的第一透镜， 以至少部分地将光聚焦到导电结构上。 制造该结构的方法通常包括以下步骤：（1）形成电耦合到第一和第二电路元件的导电结构，（2）在其上形成介电层，和（3）在电介质层上或之上形成透镜， 在导电结构之上，透镜被配置为至少部分地将光聚焦到导电结构上。 （重新）配置电路的方法通常包括以下步骤：（i）在电路表面上或附近照射足够的电气断开位于透镜下方的对应的第一保险丝的至少一个透镜，并且禁用电路的第一配置 ，以及（ii）在该电路表面上或其附近照射至少一个其他透镜，足以使位于该透镜下方的对应的第二保险丝电气断开并使电路能够进行第二配置。 该结构和方法有利地提供具有改善的可靠性和更小的芯片面积的熔丝结构，从而提高制造工艺的产量和每个晶片的模具数量（总和良好）。

    Fuse structures, methods of making and using the same, and integrated circuits including the same
    7.
    发明授权
    Fuse structures, methods of making and using the same, and integrated circuits including the same 有权
    保险丝结构，制造和使用它们的方法以及包括其的集成电路

    公开(公告)号：US07704805B1

    公开(公告)日：2010-04-27

    申请号：US12012723

    申请日：2008-02-04

    Applicant: Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    Inventor： Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    IPC: H01L21/82 ,  H01L21/8238 ,  H01L21/336

    CPC classification number: H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A fuse structure, an integrated circuit including the structure, and methods for making the structure and (re)configuring a circuit using the fuse. The fuse structure generally includes (a) a conductive structure with at least two circuit elements electrically coupled thereto, (b) a dielectric layer over the conductive structure, and (c) a first lens over both the first dielectric layer and the conductive structure configured to at least partially focus light onto the conductive structure. The method of making the structure generally includes the steps of (1) forming a conductive structure electrically coupled to first and second circuit elements, (2) forming a dielectric layer thereover, and (3) forming a lens on or over the dielectric layer and over the conductive structure, the lens being configured to at least partially focus light onto the conductive structure. The method of (re)configuring a circuit generally includes the steps of (i) irradiating at least one lens on or near a surface of the circuit sufficient to electrically disconnect a corresponding first fuse positioned under the lens and disable a first configuration of the circuit, and (ii) irradiating at least one other lens on or near the surface of the circuit sufficient to electrically disconnect a corresponding second fuse positioned under that lens and enable a second configuration of the circuit. The structure and methods advantageously provide fuse structures having improved reliability and smaller chip area, thereby increasing the yield of the manufacturing process and the numbers of die per wafer (both gross and good).

    Abstract translation: 保险丝结构，包括该结构的集成电路，以及使用该保险丝的结构和（重新）配置电路的方法。 熔丝结构通常包括（a）具有至少两个电耦合到其上的电路元件的导电结构，（b）导电结构上的电介质层，和（c）第一介电层和导电结构上的第一透镜， 以至少部分地将光聚焦到导电结构上。 制造该结构的方法通常包括以下步骤：（1）形成电耦合到第一和第二电路元件的导电结构，（2）在其上形成介电层，和（3）在电介质层上或之上形成透镜， 在导电结构之上，透镜被配置为至少部分地将光聚焦到导电结构上。 （重新）配置电路的方法通常包括以下步骤：（i）在电路表面上或附近照射足够的电气断开位于透镜下方的对应的第一保险丝的至少一个透镜，并且禁用电路的第一配置 ，以及（ii）在该电路表面上或其附近照射至少一个其他透镜，足以使位于该透镜下方的对应的第二保险丝电气断开并使电路能够进行第二配置。 该结构和方法有利地提供具有改善的可靠性和更小的芯片面积的熔丝结构，从而提高制造工艺的产量和每个晶片的模具数量（总和良好）。

    Fuse structures, methods of making and using the same, and integrated circuits including the same
    9.
    发明授权
    Fuse structures, methods of making and using the same, and integrated circuits including the same 失效
    保险丝结构，制造和使用它们的方法以及包括其的集成电路

    公开(公告)号：US07589363B1

    公开(公告)日：2009-09-15

    申请号：US11805290

    申请日：2007-05-22

    Applicant: Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    Inventor： Chuan-Cheng Cheng ,  Shuhua Yu ,  Roawen Chen ,  Albert Wu

    IPC: H01L27/10 ,  H01L29/00

    CPC classification number: H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A structure configured to disconnect circuit elements. The structure generally includes a dielectric layer over a light-absorbing structure, and a lens over the dielectric layer and the light-absorbing structure, configured to at least partially focus light onto the light-absorbing structure. The light-absorbing structure absorbs a first wavelength of light with a minimum threshold efficiency, the lens is substantially opaque to the first wavelength of light, and the dielectric layer is substantially transparent to the first wavelength of light. The structure advantageously provides improved reliability and smaller chip area, thereby increasing the yield of the manufacturing process and the numbers of die per wafer (both gross and good).

    Abstract translation: 被配置为断开电路元件的结构。 该结构通常包括在光吸收结构上的电介质层，以及在电介质层和光吸收结构上的透镜，被配置为至少部分地将光聚焦到光吸收结构上。 光吸收结构以最小阈值效率吸收第一波长的光，透镜对于第一波长的光是基本上不透明的，并且电介质层对于第一波长的光是基本透明的。 该结构有利地提供改进的可靠性和更小的芯片面积，从而提高制造工艺的产量和每个晶片的模具数量（总和良好）。

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