公开(公告)号：US20210184591A1

公开(公告)日：2021-06-17

申请号：US17175163

申请日：2021-02-12

Applicant: Alion Science and Technology Corporation

Inventor： Craig A. Keicher ,  Michael J. Harlow ,  Benjamin Craig

IPC: H02M7/00 ,  H05K5/02 ,  H02M7/217

Abstract: A power system is disclosed that includes a chassis configured to house one or more boards in which the boards are electrically coupled to one another. The boards are configured to receive external power and to output power using a plurality of different voltages. The boards are configured to receive power from at least one internal power source electrically coupled boards and to output power using a plurality of different voltages. The boards include one or more converters configured to convert power. The one or more converters are thermally interfaced with one or more portions of the chassis.

公开(公告)号：US11196353B2

公开(公告)日：2021-12-07

申请号：US17175163

申请日：2021-02-12

Applicant: Alion Science and Technology Corporation

Inventor： Craig A. Keicher ,  Michael J. Harlow ,  Benjamin Craig

IPC: H05K5/02 ,  H02M7/00 ,  H02M7/217

Abstract: A power system is disclosed that includes a chassis configured to house one or more boards in which the boards are electrically coupled to one another. The boards are configured to receive external power and to output power using a plurality of different voltages. The boards are configured to receive power from at least one internal power source electrically coupled boards and to output power using a plurality of different voltages. The boards include one or more converters configured to convert power. The one or more converters are thermally interfaced with one or more portions of the chassis.

公开(公告)号：US10958070B2

公开(公告)日：2021-03-23

申请号：US16150868

申请日：2018-10-03

Applicant: Alion Science and Technology Corporation

Inventor： Craig A Keicher ,  Michael J Harlow ,  Benjamin Craig

IPC: H02M1/32 ,  H02J1/10

Abstract: A power system is disclosed that includes a chassis configured to house a first board, a second board, and a third board, in which the boards are electrically coupled to one another. The first board is configured to receive power and to output power at a first voltage and a second voltage. The second board is configured to receive power from the first board or at least one internal battery electrically coupled to the second board and to output power using at least two voltages. The third board is configured to receive power from the second board and to output power at two voltages. The boards include one or more converters configured to convert power. The one or more converters are thermally interfaced with one or more portions of the chassis so as to conduct heat into a respective portion of the chassis.