公开(公告)号：US11548373B1

公开(公告)日：2023-01-10

申请号：US16214791

申请日：2018-12-10

Applicant: Amazon Technologies, Inc.

Inventor： Nicolas Kurczewski ,  Ennio Claretti ,  Nicolas Hostein ,  Brett Skaloud ,  Andrew Stubbs ,  Kyle Washabaugh

IPC: B60K11/08 ,  G05D1/02 ,  G05B19/418 ,  B60P3/00 ,  A47J43/00

Abstract: A chassis and skin of a delivery Autonomous Ground Vehicle include discrete upper and lower thermal management systems. The lower thermal management system is indirect, as is moves air through a closed duct that is in contact with high-heat dissipating components via heat sinks. The upper thermal management system is direct, as it moves air into the interior cavity of the AGV to cool sensors and other electronic equipment.