公开(公告)号：US20250072134A1

公开(公告)日：2025-02-27

申请号：US18767001

申请日：2024-07-09

Applicant: Apple Inc.

Inventor： Dong Zheng ,  Kenneth J. Vampola ,  Seshasayee Gaddamraja ,  Emma C. Thomson

IPC: H01L27/146

Abstract: Ambient light sensor modules may be formed using a wafer-level process in which a filter and a diffuser are stacked on a silicon substrate or a combination substrate that includes multiple photosensors. The stack may be diced, filled with opaque material, and diced again to form multiple ambient light sensor modules. The resulting modules may include a silicon substrate with a photosensor and through-silicon vias, a filter on the silicon substrate, and a diffuser coupled to the filter. There may be an air gap between a portion of the diffuser and the photosensor. The air gap may be formed from a recess in the diffuser or from spacers between the filter and the diffuser. Alternatively, the diffuser may be applied as a coating on the filter. By forming the ambient light sensor modules at the wafer level, the modules may have smaller footprints and/or volumes.