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公开(公告)号：US12219256B1
公开(公告)日：2025-02-04
申请号：US17934563
申请日：2022-09-22
Applicant: Apple Inc.
Inventor： Himesh Patel , Qiang Yang , Peng Chen
Abstract: A flexure for a camera module is provided. The flexure includes a dynamic platform to which an image sensor is connected such that the image sensor moves with the dynamic platform. The flexure also includes a static platform connected to a static portion of the camera. The flexure further includes a plurality of flexure arms that mechanically connect the dynamic platform to the static platform. The plurality of flexure arms includes a first flexure arm including one or more signal traces having a first impedance and a base layer having a first width. The plurality of flexure arms includes a second flexure arm including one or more signal traces having a second impedance and a base layer having a second width. The first impedance is greater than the second impedance. The first width is less than the second width. The second flexure arm routes image data from the image sensor.
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公开(公告)号：US12206969B2
公开(公告)日：2025-01-21
申请号：US17818813
申请日：2022-08-10
Applicant: Apple Inc.
Inventor： Himesh Patel , Phillip R Sommer
Abstract: Various embodiments include sensor shift flexure arrangements for improved signal routing. For example, a camera with sensor shift actuation may include a flexure for suspending an image sensor from a stationary structure of the camera, and for allowing motion of the image sensor enabled by one or more actuators of the camera. The flexure may be configured to convey electrical signals between the image sensor and a flex circuit in some embodiments. According to some embodiments, the flexure may include a stack of layers comprising an electrical grounding portion that has an additional conductive layer adjacent to a base layer, which may reduce the overall resistivity of a ground current return path. In some embodiments, the flexure may additionally or alternatively include an impedance adjusting feature configured to adjust the impedance of an electrical signal pad used to connect the flexure with another component of the camera.
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公开(公告)号：US12088897B1
公开(公告)日：2024-09-10
申请号：US17932619
申请日：2022-09-15
Applicant: Apple Inc.
Inventor： Himesh Patel , Kai Min , Phillip R Sommer , Qiang Yang
CPC classification number: H04N23/54 , H04N23/52 , H04N23/57 , H04N23/687 , G03B3/10
Abstract: A flexure for a camera includes a dynamic platform to which an image sensor and a substrate are connected such that the image sensor and the substrate move together with the dynamic platform. A driver associated with an actuator to move the image sensor relative to a lens group is mounted to the substrate. The flexure also includes a static platform connected to a static portion of the camera, a plurality of flexure arms that mechanically connect the dynamic platform to the static platform, a routing layer and a base layer both at least partially forming the dynamic platform, the static platform, and the plurality of flexure arms, and at least one segmentation region extending through the base layer and configured to physically isolate a return current from the driver and through the base layer from a return current from the image sensor and through the base layer.
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公开(公告)号：US20250102367A1
公开(公告)日：2025-03-27
申请号：US18373839
申请日：2023-09-27
Applicant: Apple Inc.
Inventor： Himesh Patel , Anish Bhide , Shahrooz Shahparnia
Abstract: Described herein are sensing arrangements for a camera module that include a position sensor, a temperature sensor, a driver chip, and a multiplexer. The position sensor has a first bias input and a first set of terminals. The temperature sensor has a temperature-sensitive resistor, a second bias input, and a second set of terminals. The driver chip includes a bias output connected to a bias current source and a set of inputs for receiving a voltage signal. The multiplexer is configured to selectively connect the position sensor or the temperature sensor to the driver chip, such that, the bias output is connected to the first or the second bias input, respectively, and the set of inputs is connected to the first or the second set of terminals, respectively, thereby causing the voltage signal received by the set of inputs to indicate a position or a temperature of the camera module, respectively.
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Patent Agency Ranking
公开(公告)号：US12063742B1
公开(公告)日：2024-08-13
申请号：US17715852
申请日：2022-04-07
Applicant: Apple Inc.
Inventor： Sai Harsha Jandhyala , Himesh Patel
IPC: H05K1/18 , G03B5/04 , G03B13/36 , H02K41/035 , H04N23/54 , H04N23/55 , H04N23/67 , H04N23/68 , H05K3/30
CPC classification number: H05K1/181 , G03B5/04 , G03B13/36 , H02K41/0354 , H04N23/54 , H04N23/55 , H04N23/67 , H04N23/687 , H05K3/303 , G03B2205/0069 , H05K2201/1009 , H05K2201/10151
Abstract: A camera may include a printed circuit board (PCB) that may include at least one coil and at least one position sensor. The coil may be embedded at least partially inside the PCB at a first side of the PCB, whilst the position sensor may be attached to the PCB at a second side opposite the first side. The PCB may include an aperture through the PCB at a location corresponding to the position sensor to enhance sensing of the position sensor. The PCB may further include at least one recess inside which the position sensor may be attached to the PCB.
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公开(公告)号：US11974031B1
公开(公告)日：2024-04-30
申请号：US17715850
申请日：2022-04-07
Applicant: Apple Inc.
Inventor： Himesh Patel , Roshan Murthy
CPC classification number: H04N23/54 , G02B27/646 , G03B13/36 , H04N23/55 , H04N23/687 , H10K39/32 , G03B2205/0069 , H02K41/0354
Abstract: Various embodiments include a hybrid sensor shift platform comprising a multi-core substrate for a camera. The hybrid sensor shift platform may be coupled with an image sensor. The camera may include one or more actuators configured to move the hybrid sensor shift platform together with the image sensor. The multi-core substrate may be coupled with one or more other substrates to form the hybrid sensor shift platform. For example, the hybrid sensor shift platform may include a multi-core organic substrate and a ceramic substrate in various embodiments.
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公开(公告)号：US11792516B1
公开(公告)日：2023-10-17
申请号：US17675666
申请日：2022-02-18
Applicant: Apple Inc.
Inventor： Himesh Patel , Kai Min , Phillip R. Sommer
IPC: H04N23/68 , H02K11/02 , H02K41/035 , H04N23/54 , H04N23/55
CPC classification number: H04N23/687 , H02K11/02 , H02K41/0356 , H04N23/54 , H04N23/55
Abstract: Various embodiments include flex circuit arrangements for a camera with sensor shift actuation. Some embodiments include a flexure-circuit hybrid structure. Some embodiments include an actuation-module flex circuit hybrid structure. In some embodiments, the hybrid structures may include different portions that share multiple layers of a plurality of stacked layers. In some embodiments, one portion of a hybrid structure may include one or more layers that are different from the layers in another portion of the hybrid structure.
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公开(公告)号：US11962881B1
公开(公告)日：2024-04-16
申请号：US17718210
申请日：2022-04-11
Applicant: Apple Inc.
Inventor： Himesh Patel , Kai Min , Phillip R. Sommer , Pavle Stojanovic , Qiang Yang
CPC classification number: H04N23/54 , H04N23/665
Abstract: Various embodiments include sensor shift flexure arrangements for improved signal routing. For example, a camera with sensor shift actuation may include a flexure for suspending an image sensor from a stationary structure of the camera, and for allowing motion of the image sensor enabled by one or more actuators of the camera. The flexure may be configured to convey electrical signals between the image sensor and a flex circuit in some embodiments. According to some embodiments, the flexure may include a stack of layers comprising a conductive layer and an electrical grounding. The conductive layer may include a signal pad region and a signal trace region. A distance between at least one section of the signal pad region and the electrical grounding may be greater than a distance between at least a section of the signal trace region and the electrical grounding.
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公开(公告)号：US20230056192A1
公开(公告)日：2023-02-23
申请号：US17818813
申请日：2022-08-10
Applicant: Apple Inc.
Inventor： Himesh Patel , Phillip R. Sommer
IPC: H04N5/225
Abstract: Various embodiments include sensor shift flexure arrangements for improved signal routing. For example, a camera with sensor shift actuation may include a flexure for suspending an image sensor from a stationary structure of the camera, and for allowing motion of the image sensor enabled by one or more actuators of the camera. The flexure may be configured to convey electrical signals between the image sensor and a flex circuit in some embodiments. According to some embodiments, the flexure may include a stack of layers comprising an electrical grounding portion that has an additional conductive layer adjacent to a base layer, which may reduce the overall resistivity of a ground current return path. In some embodiments, the flexure may additionally or alternatively include an impedance adjusting feature configured to adjust the impedance of an electrical signal pad used to connect the flexure with another component of the camera.
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