公开(公告)号：WO2013165758A1

公开(公告)日：2013-11-07

申请号：PCT/US2013/037850

申请日：2013-04-23

Applicant: APPLE INC.

Inventor： DINH, Richard, H. ,  JARVIS, Daniel, W.

IPC: B29C63/34 ,  H04M1/02

CPC classification number: B29C63/34 ,  B29C65/08 ,  B29C66/474 ,  B29C2793/0018 ,  B29L2031/3481 ,  B29L2031/737 ,  Y10T29/4998

Abstract: Electronic device housing structures and other structures may be formed from molded plastic. Plastic structures such as injection molding housing structures and other structures may be provided with openings. An opening may have sidewall surfaces. Machining operations and other techniques may be used in forming the openings. Openings may be processed to enhance resistance to stress- induced cracking of the plastic structures along the sidewall surfaces. Cracking resistance may be obtained by activating the surface using heat or laser treatment and by electroplating the activated surface to form a metal liner structure. Surface treatments using applied liquid chemicals or heat may form a treated layer on the surface of an opening with enhanced cracking resistance. A plastic sleeve or other insert may form a liner structure in an opening that resists cracking. Liner structures may also be formed by applying heat or light to a coating in an opening.

Abstract translation: 电子设备外壳结构和其他结构可以由模制塑料形成。 塑料结构例如注模壳体结构和其它结构可以设置有开口。 开口可以具有侧壁表面。 可以使用加工操作和其它技术来形成开口。 可以处理开口以增强沿着侧壁表面对塑性结构的应力引起的破裂的抗性。 可以通过使用热或激光处理来激活表面并且通过电镀激活的表面以形成金属衬垫结构来获得抗开裂性。 使用应用的液体化学品或热的表面处理可以在开口的表面上形成具有增强的抗开裂性的处理层。 塑料套筒或其他插入件可以在开口中形成抵抗裂纹的衬里结构。 也可以通过向开口中的涂层施加热或光来形成衬里结构。

公开(公告)号：WO2013130396A2

公开(公告)日：2013-09-06

申请号：PCT/US2013/027627

申请日：2013-02-25

Applicant: APPLE INC.

Inventor： POPE, Benjamin, J. ,  JARVIS, Daniel, W. ,  MYERS, Scott, A. ,  MERZ, Nicholas, G.l.

IPC: G06K9/00

CPC classification number: G06K9/00013 ,  G06F3/0416 ,  G06F3/044 ,  G06K9/0002 ,  H04B5/0012 ,  H04B5/0075

Abstract: An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment.

Abstract translation: 电子设备可以具有诸如传感器的电子组件。 传感器可以具有使用导电结构收集传感器数据的传感器电路。 传感器可以是使用导电结构形成电容式触摸传感器电极的触摸传感器，或者可以是使用具有指纹电极阵列的导电结构来处理指纹传感器信号的指纹传感器。 近场通信电路可以被包括在电子设备中。 当以传感器模式操作时，传感器电路可以使用导电结构来收集指纹或其他传感器数据。 当以近场通信模式操作时，近场通信电路可以使用导电结构来发送和接收电容耦合或电感耦合的近场通信信号。 指纹传感器可以具有与外部设备通信的光学结构。

公开(公告)号：WO2019032225A1

公开(公告)日：2019-02-14

申请号：PCT/US2018/040648

申请日：2018-07-02

Applicant: APPLE INC.

Inventor： FLETCHER, Ashley, E. ,  PAKULA, David, A. ,  JARVIS, Daniel, W. ,  KOLE, Jared, M.

IPC: H04M1/02

Abstract: An electronic device that includes a vision system carried by a bracket assembly is disclosed. The vision system may include a first camera module that captures an image of an object, a light emitting element that emits light rays toward the object, and a second camera module that receives light rays reflected from the object. The light rays may include infrared light rays. The bracket assembly is designed not only carry the aforementioned modules, but to also maintain a predetermined and fixed separation between the modules. The bracket assembly may form a rigid, multi-piece bracket assembly to prevent bending, thereby maintaining the predetermined separation. The electronic device may include a transparent cover designed to couple with a housing. The transparent cover incudes an alignment module designed to engage a module and provide a moving force that aligns the bracket assembly and the modules to a desired location in the housing.

公开(公告)号：EP2810215A2

公开(公告)日：2014-12-10

申请号：EP13708602.1

申请日：2013-02-25

Applicant: Apple Inc.

Inventor： POPE, Benjamin, J. ,  JARVIS, Daniel, W. ,  MYERS, Scott, A. ,  MERZ, Nicholas, G.l.

IPC: G06K9/00 ,  H04B5/00

CPC classification number: G06K9/00013 ,  G06F3/0416 ,  G06F3/044 ,  G06K9/0002 ,  H04B5/0012 ,  H04B5/0075

Abstract: An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment.

Abstract translation: 电子设备可以具有诸如传感器的电气部件。 传感器可以具有使用导电结构收集传感器数据的传感器电路。 传感器可以是使用导电结构形成电容式触摸传感器电极的触摸传感器，或者可以是使用具有指纹电极阵列的导电结构来处理指纹传感器信号的指纹传感器。 近场通信电路可以包括在电子设备中。 当在传感器模式下操作时，传感器电路可以使用导电结构来收集指纹或其他传感器数据。 当在近场通信模式下操作时，近场通信电路可以使用导电结构来发射和接收电容耦合或电感耦合近场通信信号。 指纹传感器可以具有与外部设备通信的光学结构。