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公开(公告)号:WO2019005586A1
公开(公告)日:2019-01-03
申请号:PCT/US2018/038845
申请日:2018-06-21
Applicant: APPLE INC.
Inventor: WANG, Paul, X. , LEHMANN, Alex, J. , ROCKWELL, Michael J. , CHEUNG, Michael Y. , CHANG, Ray L. , SUN, Hongcheng , BULLOCK, Ian M. , NEKIMKEN, Kyle J. , CORDIER, Madeleine S. , KIM, Seung Wook , BLOOM, David H. , JOHNSTON, Scott G.
IPC: G06F3/01 , G06F1/16 , G06F3/042 , G06F3/0481 , G06T19/00 , G02B27/01 , G06F3/0488 , G06F3/0346
Abstract: A finger-mounted device may include finger-mounted units. The finger-mounted units may each have a body that serves as a support structure for components such as force sensors, accelerometers, and other sensors and for haptic output devices. The body may have sidewall portions coupled by a portion that rests adjacent to a user's fingernail. The body may be formed from deformable material such as metal or may be formed from adjustable structures such as sliding body portions that are coupled to each other using magnetic attraction, springs, or other structures. The body of each finger-mounted unit may have a U- shaped cross-sectional profile that leaves the finger pad of each finger exposed when the body is coupled to a fingertip of a user's finger. Control circuitry may gather finger press input, lateral finger movement input, and finger tap input using the sensors and may provide haptic output using the haptic output device.
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公开(公告)号:WO2019183257A1
公开(公告)日:2019-09-26
申请号:PCT/US2019/023225
申请日:2019-03-20
Applicant: APPLE INC.
Inventor: MCQUEEN, Travis , DELLA SILVA, Clark , JOHNSTON, Scott G. , BARNETT, Wade , MCQUEEN, Trevor
IPC: H04L29/08 , G01S5/00 , H02G3/12 , H02G3/00 , G01C21/20 , G06F16/29 , G06F17/50 , G06T3/00 , G06T11/00 , G06T11/20 , G06T17/00
Abstract: A modular host system may include one or more processors and a host unit (810(1)-(15)) installed in a support structure of a building. The host unit can be configured to receive and house an accessory (e.g., modular accessory) and electrically couple to an electrical source. The host unit can include a power gating module configured to couple electrical power from the electrical source to the accessory, and a communication module configured to communicate with one or more additional host units installed in the building. The one or more processors may be configured to determine a distance between the host unit and each of the one or more additional host units based on the communication with the one or more additional host units, and determine a floor plan of the building based at least oil a distance from the host unit to each the one or more additional host units.
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公开(公告)号:EP3485355A1
公开(公告)日:2019-05-22
申请号:EP18740433.0
申请日:2018-06-21
Applicant: Apple Inc.
Inventor: WANG, Paul, X. , LEHMANN, Alex, J. , ROCKWELL, Michael J. , CHEUNG, Michael Y. , CHANG, Ray L. , SUN, Hongcheng , BULLOCK, Ian M. , NEKIMKEN, Kyle J. , CORDIER, Madeleine S. , KIM, Seung Wook , BLOOM, David H. , JOHNSTON, Scott G.
IPC: G06F3/01 , G06F1/16 , G06F3/042 , G06F3/0481 , G06T19/00 , G02B27/01 , G06F3/0488 , G06F3/0346
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