公开(公告)号：US11581351B2

公开(公告)日：2023-02-14

申请号：US16935094

申请日：2020-07-21

Applicant: Apple Inc.

Inventor： Aurelien R. Hubert ,  Jee Tung Tan ,  Steven Webster ,  Douglas S. Brodie ,  Qiang Yang ,  Masahito Morita

IPC: H01L27/146 ,  H04N5/225 ,  H04M1/02

Abstract: A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.

公开(公告)号：US20250105228A1

公开(公告)日：2025-03-27

申请号：US18475054

申请日：2023-09-26

Applicant: Apple Inc.

Inventor： Kyusang Kim ,  David M Kindlon ,  Kishore N Renjan ,  Manoj Vadeentavida ,  Bilal Mohamed Ibrahim Kani ,  Benjamin J Grena ,  Ali N Ergun ,  Jerzy S Guterman ,  Jee Tung Tan ,  Steven Webster ,  Parin R Dedhia ,  Howell John Chua Toc ,  Mandar S Painaik ,  Abhay Maheshwari ,  Wyeman Chen ,  Yanfeng Chen ,  Andrew N Leopold ,  Jun Zhang ,  Dhruv Gaba

IPC: H01L25/16

Abstract: Packages and methods of assembly are described in which barriers are utilized during overmolding to improve volumetric efficiency. In one embodiment, a barrier includes multiple variable height components located on an interior of the barrier, where the barrier prevents the variable height components from being overmolded during the encapsulation process. In one embodiment, a barrier includes a camera module mounted on an image sensor located on an interior of the barrier, where the barrier prevents the camera module and image sensor from being overmolded during the encapsulation process. In an embodiment, a barrier is mounted on a secondary tier with the secondary tier mounted on a primary tier, where the barrier prevents multiple connector components located on an interior of the barrier from being overmolded during the encapsulation process.

公开(公告)号：US20250112383A1

公开(公告)日：2025-04-03

申请号：US18378091

申请日：2023-10-09

Applicant: Apple Inc.

Inventor： Steven Webster ,  Henry M. Daghighian ,  Jee Tung Tan ,  Peter Chin Ting Soon

IPC: H01R12/62 ,  H01R12/77 ,  H01R13/6592 ,  H01R24/50

Abstract: Examples can provide extended-range high-speed interconnect by providing microcoax cables in a hybrid flexible circuit board, which can be referred to as a hybrid flex or microcoax flex. This hybrid flex can be used to convey signals an extended distance within an electronic device. Multiple signals can be conveyed using corresponding microcoax cables. The microcoax cables can include a center conductor, an insulating layer, and an outside shield layer. The cables can be held in position in the hybrid flex relative to each other by a polyimide or other insulative layer. Copper layers can be provided on either or both the top and bottom of the polyimide or other insulative layer. Additional conductors can be embedded in the polyimide other insulative layer to convey power and ground. The microcoax and other conductors can be soldered to a flexible circuit board or other substrate using jet soldering.

公开(公告)号：US20210028216A1

公开(公告)日：2021-01-28

申请号：US16935094

申请日：2020-07-21

Applicant: Apple Inc.

Inventor： Aurelien R. Hubert ,  Jee Tung Tan ,  Steven Webster ,  Douglas S. Brodie ,  Qiang Yang ,  Masahito Morita

IPC: H01L27/146 ,  H04M1/02 ,  H04N5/225

Abstract: A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.