公开(公告)号：US11990695B2

公开(公告)日：2024-05-21

申请号：US17662715

申请日：2022-05-10

Applicant: Apple Inc.

Inventor： Sam Mahin Shirazi ,  Eric T. Chiang ,  Matthew Burke ,  Tiexuan Wang ,  Yong Gang Li ,  Henry H. Yang

IPC: H01R12/57 ,  H01R4/02 ,  H01R43/20 ,  H01R13/22 ,  H05K1/14 ,  H05K1/18

CPC classification number: H01R12/57 ,  H01R4/02 ,  H01R43/205 ,  H01R13/22 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10128

Abstract: Electronic assemblies and methods of attaching retention structures are described. The electronic assemblies may include a receiving substrate and a retention structure bonded to the receiving substrate. The retention structure may be patterned to include openings such as slot openings or a fishbone pattern in order to receive a pair of solder joints to bond the retention structure to a top side of the receiving substrate.

公开(公告)号：US20230369790A1

公开(公告)日：2023-11-16

申请号：US17662715

申请日：2022-05-10

Applicant: Apple Inc.

Inventor： Sam Mahin Shirazi ,  Eric T. Chiang ,  Matthew Burke ,  Tiexuan Wang ,  Yong Gang Li ,  Henry H. Yang

IPC: H01R12/57 ,  H01R4/02 ,  H01R43/20

CPC classification number: H01R12/57 ,  H01R4/02 ,  H01R43/205 ,  H05K1/147

Abstract: Electronic assemblies and methods of attaching retention structures are described. The electronic assemblies may include a receiving substrate and a retention structure bonded to the receiving substrate. The retention structure may be patterned to include openings such as slot openings or a fishbone pattern in order to receive a pair of solder joints to bond the retention structure to a top side of the receiving substrate.