Patent search ap:("Apple Inc.") AND inv:"OU Page Fang"

1.

发明公开
METHOD OF TRANSFERRING PATTERNED MICRO-LED DIE ONTO A SILICON CARRIER FOR WAFER-TO-WAFER HYBRID BONDING TO A CMOS BACKPLANE 审中-公开

公开(公告)号：EP4552158A1

公开(公告)日：2025-05-14

申请号：EP23866050.0

申请日：2023-09-01

Applicant: Apple Inc.

Inventor： BROCKMAN, Justin S. , OU, Fang , HE, Lina , SIZOV, Dmitry S. , ZHANG, Lei

IPC: H01L25/16 , H01L25/075 , H01L33/62 , H01L31/02 , H01L33/58 , H01L23/00

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