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公开(公告)号：US09752877B2
公开(公告)日：2017-09-05
申请号：US14838075
申请日：2015-08-27
Applicant: Apple Inc.
Inventor： Manoj K Bhattacharyya , Christopher E. Balcells , Jian Guo , Peter G. Hartwell
CPC classification number: G01C17/02 , G01R33/0011 , G01R33/093 , G01R35/005
Abstract: An electronic device may be provided with an electronic compass. The electronic compass may include magnetic sensors. The magnetic sensors may include thin-film magnetic sensor elements such as giant magnetoresistance sensor elements. Magnetic flux concentrators may be used to guide magnetic fields through the sensor elements. To reduce offset in the electronic compass, the magnetic flux concentrators may be demagnetized by applying a current to a coil in the housing. The coil may be formed from loops of metal traces within a printed circuit or other loops of conductive paths. Magnetic flux concentrators may have ring shapes. A ring-shaped magnetic flux concentrator may be formed from multiple thin stacked layers of soft magnetic material separated by non-magnetic material.
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Patent Agency Ranking
公开(公告)号：US09656856B2
公开(公告)日：2017-05-23
申请号：US15226824
申请日：2016-08-02
Applicant: Apple Inc.
Inventor： Tongbi Jiang , Jie-Hua Zhao , Peter G. Hartwell
CPC classification number: B81B7/0048 , B81B2207/012 , B81B2207/07 , B81B2207/99 , B81C3/001 , B81C2203/035 , B81C2203/07
Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
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公开(公告)号：US20160167949A1
公开(公告)日：2016-06-16
申请号：US14568845
申请日：2014-12-12
Applicant: Apple Inc.
Inventor： Tongbi Jiang , Jie-Hua Zhao , Peter G. Hartwell
IPC: B81B7/00
CPC classification number: B81B7/0048 , B81B2207/012 , B81B2207/07 , B81B2207/99 , B81C3/001 , B81C2203/035 , B81C2203/07
Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
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公开(公告)号：US20160340175A1
公开(公告)日：2016-11-24
申请号：US15226824
申请日：2016-08-02
Applicant: Apple Inc.
Inventor： Tongbi Jiang , Jie-Hua Zhao , Peter G. Hartwell
CPC classification number: B81B7/0048 , B81B2207/012 , B81B2207/07 , B81B2207/99 , B81C3/001 , B81C2203/035 , B81C2203/07
Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
Abstract translation: 描述了MEMS封装，模块和制造方法。 在一个实施例中，MEMS封装包括安装在表面安装基板的正面上的MEMS管芯和IC管芯，以及在表面安装基板的前侧封装IC管芯和MEMS管芯的模塑料。 在一个实施例中，在表面安装基板的背侧上的着陆焊盘布置形成并固定平面区域，用于将表面安装基板粘合到不直接在MEMS管芯下方的模块基板。
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5.发明申请Electronic Device Having Electronic Compass With Demagnetizing Coil And Annular Flux Concentrating Yokes 有权具有回磁线圈和环形磁通集中磁轭的电子罗盘的电子装置公开(公告)号：US20160313122A1
公开(公告)日：2016-10-27
申请号：US14838075
申请日：2015-08-27
Applicant: Apple Inc.
Inventor： Manoj K Bhattacharyya , Christopher E. Balcells , Jian Guo , Peter G. Hartwell
CPC classification number: G01C17/02 , G01R33/0011 , G01R33/093 , G01R35/005
Abstract: An electronic device may be provided with an electronic compass. The electronic compass may include magnetic sensors. The magnetic sensors may include thin-film magnetic sensor elements such as giant magnetoresistance sensor elements. Magnetic flux concentrators may be used to guide magnetic fields through the sensor elements. To reduce offset in the electronic compass, the magnetic flux concentrators may be demagnetized by applying a current to a coil in the housing. The coil may be formed from loops of metal traces within a printed circuit or other loops of conductive paths. Magnetic flux concentrators may have ring shapes. A ring-shaped magnetic flux concentrator may be formed from multiple thin stacked layers of soft magnetic material separated by non-magnetic material.
Abstract translation: 电子设备可以设置有电子罗盘。 电子罗盘可以包括磁性传感器。 磁传感器可以包括诸如巨磁阻传感器元件的薄膜磁传感器元件。 磁通集中器可用于引导磁场穿过传感器元件。 为了减少电子罗盘中的偏移，可以通过向壳体中的线圈施加电流来使磁通量集中器退磁。 线圈可以由印刷电路中的金属迹线或其它导电路径环形成。 磁通集中器可以具有环形。 可以由由非磁性材料分离的多个软磁材料层叠形成环形磁通集中器。
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公开(公告)号：US09446941B2
公开(公告)日：2016-09-20
申请号：US14568845
申请日：2014-12-12
Applicant: Apple Inc.
Inventor： Tongbi Jiang , Jie-Hua Zhao , Peter G. Hartwell
CPC classification number: B81B7/0048 , B81B2207/012 , B81B2207/07 , B81B2207/99 , B81C3/001 , B81C2203/035 , B81C2203/07
Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
Abstract translation: 描述了MEMS封装，模块和制造方法。 在一个实施例中，MEMS封装包括安装在表面安装基板的正面上的MEMS管芯和IC管芯，以及在表面安装基板的前侧封装IC管芯和MEMS管芯的模塑料。 在一个实施例中，在表面安装基板的背侧上的着陆焊盘布置形成并固定平面区域，用于将表面安装基板粘合到不直接在MEMS管芯下方的模块基板。
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