公开(公告)号：EP3151342A3

公开(公告)日：2017-08-09

申请号：EP16183823.0

申请日：2016-08-11

Applicant: Apple Inc.

Inventor： TALALAYEV, Anton ,  NARAJOWSKI, David H. ,  LIGTENBERG, Christiaan A. ,  AMINI, Mahmoud R. ,  LEGGETT, William F. ,  SILVANTO, Mikael M. ,  STRINGER, Christopher J. ,  TZIVISKOS, George ,  COOPER, Edward J. ,  HOPKINSON, Ron Alan ,  MILLER, Ari Parsons

IPC: H01R12/73 ,  H01R24/62 ,  H01R13/6582 ,  H01R13/6594 ,  H01R13/66 ,  H01R25/00 ,  H01R12/71

CPC classification number: H01R24/60 ,  H01R12/7082 ,  H01R12/716 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6594 ,  H01R13/6658 ,  H01R24/62 ,  H01R25/006

Abstract: Interconnect devices are described. In some examples, an interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.

Abstract translation: 描述了互连设备。 在一些示例中，互连装置可以在第一平面中对齐并且可以包括具有舌部分和销部分的印刷电路板。 销部分可以包括远离印刷电路板延伸的多个销。 互连装置可以被配置为与在第二平面中对齐的主逻辑板电耦合。 特别地，多个引脚可以插入主逻辑板内的相应电接触位置以形成双平面连接。 双平面连接可以以最小化高速数据传输的信号损失的方式进行。

公开(公告)号：EP3151342B1

公开(公告)日：2019-01-23

申请号：EP16183823.0

申请日：2016-08-11

Applicant: Apple Inc.

Inventor： TALALAYEV, Anton ,  NARAJOWSKI, David H. ,  LIGTENBERG, Christiaan A. ,  AMINI, Mahmoud R. ,  LEGGETT, William F. ,  SILVANTO, Mikael M. ,  STRINGER, Christopher J. ,  TZIVISKOS, George ,  COOPER, Edward J. ,  HOPKINSON, Ron Alan ,  MILLER, Ari Parsons

IPC: H01R12/73 ,  H01R24/62 ,  H01R13/6582 ,  H01R13/6594 ,  H01R13/66 ,  H01R25/00 ,  H01R12/71

公开(公告)号：EP3151342A2

公开(公告)日：2017-04-05

申请号：EP16183823.0

申请日：2016-08-11

Applicant: Apple Inc.

Inventor： TALALAYEV, Anton ,  NARAJOWSKI, David H. ,  LIGTENBERG, Christiaan A. ,  AMINI, Mahmoud R. ,  LEGGETT, William F. ,  SILVANTO, Mikael M. ,  STRINGER, Christopher J. ,  TZIVISKOS, George ,  COOPER, Edward J.

IPC: H01R12/73 ,  H01R24/62 ,  H01R13/6582 ,  H01R13/6594

CPC classification number: H01R24/60 ,  H01R12/7082 ,  H01R12/716 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6594 ,  H01R13/6658 ,  H01R24/62 ,  H01R25/006

Abstract: Interconnect devices are described. In some examples, an interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.

Abstract translation: 描述了互连设备。 在一些示例中，互连装置可以在第一平面中对准并且可以包括具有舌部和针部分的印刷电路板。 销部分可以包括远离印刷电路板延伸的多个销。 互连装置可以被配置为与在第二平面中对准的主逻辑板电耦合。 特别地，多个引脚可以插入到主逻辑板内的对应的电接触位置中以形成双平面连接。 双平面连接可以以最小化高速数据传输的信号损失的方式进行。