公开(公告)号：US12166911B2

公开(公告)日：2024-12-10

申请号：US17472397

申请日：2021-09-10

Applicant: Apple Inc.

Inventor： Owen D. Hale ,  Dale T. Morgan ,  Andrew U. Leopold ,  Yifan Zhao ,  Nicholas Merz ,  Daniel Jarvis ,  James B. Smith ,  Macey E. Dade ,  Samuel J. Pliska ,  Ethan R. Stobbe ,  Cameron Bauer ,  Ian A. Spraggs ,  Marwan Rammah ,  Bryan D. Keen ,  David A. Pakula

IPC: H04M1/02

Abstract: A mobile phone may include a housing, a battery at least partially within the housing, and a circuit board assembly at least partially within the housing and positioned along a side of the battery. The circuit board assembly may include a first circuit board defining a first hole, a second circuit board defining a second hole, a wall structure between the first circuit board and the second circuit board and attached to an inner surface of the first circuit board and an inner surface of the second circuit board, and a fastener assembly configured to retain the first circuit board to the second circuit board.

公开(公告)号：US20220286543A1

公开(公告)日：2022-09-08

申请号：US17472397

申请日：2021-09-10

Applicant: Apple Inc.

Inventor： Owen D. Hale ,  Dale T. Morgan ,  Andrew U. Leopold ,  Yifan Zhao ,  Nicholas Merz ,  Daniel Jarvis ,  James B. Smith ,  Macey E. Dade ,  Samuel J. Pliska ,  Ethan R. Stobbe ,  Cameron Bauer ,  Ian A. Spraggs ,  Marwan Rammah ,  Bryan D. Keen ,  David A. Pakula

IPC: H04M1/02

Abstract: A mobile phone may include a housing, a battery at least partially within the housing, and a circuit board assembly at least partially within the housing and positioned along a side of the battery. The circuit board assembly may include a first circuit board defining a first hole, a second circuit board defining a second hole, a wall structure between the first circuit board and the second circuit board and attached to an inner surface of the first circuit board and an inner surface of the second circuit board, and a fastener assembly configured to retain the first circuit board to the second circuit board.