公开(公告)号：US20190304825A1

公开(公告)日：2019-10-03

申请号：US16443185

申请日：2019-06-17

Applicant: Applied Materials, Inc.

Inventor： Dale R. Du BOIS ,  Juan Carlos ROCHA-ALVAREZ ,  Sanjeev BALUJA ,  Ganesh BALASUBRAMANIAN ,  Lipyeow YAP ,  Jianhua ZHOU ,  Thomas NOWAK

IPC: H01L21/68 ,  H01L21/687 ,  H01L21/67 ,  H01L21/324 ,  B05C13/00 ,  H01J37/32 ,  C23C16/458

Abstract: A method and apparatus for heating a substrate in a chamber are provided. an apparatus for positioning a substrate in a processing chamber. In one embodiment, the apparatus comprises a substrate support assembly having a support surface adapted to receive the substrate and a plurality of centering fingers for supporting the substrate at a distance parallel to the support surface and for centering the substrate relative to a reference axis substantially perpendicular to the support surface. The plurality of the centering fingers are movably disposed along a periphery of the support surface, and each of the plurality of centering fingers comprises a first end portion for either contacting or supporting a peripheral edge of the substrate.