公开(公告)号：US20220013375A1

公开(公告)日：2022-01-13

申请号：US17329948

申请日：2021-05-25

Applicant: Applied Materials, Inc.

Inventor： Jean DELMAS ,  Steven VERHAVERBEKE ,  Kurtis LESCHKIES

IPC: H01L21/67 ,  F27B9/36 ,  H01L21/677 ,  H01L21/324

Abstract: Embodiments of the disclosure relate to an apparatus and method for annealing one or more semiconductor substrates. In one embodiment, a processing chamber is disclosed. The processing chamber includes a chamber body enclosing an internal volume, a substrate support disposed in the internal volume and configured to support a substrate during processing, a gas panel configured to provide a processing fluid into the internal volume, and a temperature-controlled fluid circuit configured to maintain the processing fluid at a temperature above a condensation point of the processing fluid. The temperature-controlled fluid circuit includes a gas conduit fluidly coupled to a port on the chamber body at a first end and to the gas panel at a second end.

公开(公告)号：US20190139793A1

公开(公告)日：2019-05-09

申请号：US16170683

申请日：2018-10-25

Applicant: Applied Materials, Inc.

Inventor： Jean DELMAS ,  Charles T. CARLSON ,  Robert Brent VOPAT

IPC: H01L21/67 ,  H01L21/324 ,  F22G7/00

Abstract: A system for annealing substrates is provided. The system includes a first boiler having an input coupled to a water source; a second boiler having an input connected to an output of the first boiler; and a batch processing chamber coupled to the output of the second boiler, wherein the batch processing chamber is configured to anneal a plurality of substrates using steam from the second boiler.

公开(公告)号：US20220373883A1

公开(公告)日：2022-11-24

申请号：US17883422

申请日：2022-08-08

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Jean DELMAS ,  Steven VERHAVERBEKE ,  Chintan BUCH

IPC: G03F7/00 ,  B29C59/02 ,  B29C45/37

Abstract: An imprint lithography stamp includes a stamp body having a patterned surface and formed from a fluorinated ethylene propylene copolymer. The imprint lithography stamp further includes a backing plate with a plurality of through-holes with portions of the stamp body extending into the through-holes to adhere the stamp body to the backing plate. The patterned surface of the stamp body has a plurality of protrusions extending from the stamp body, which are used to form high aspect ratio features at high processing temperatures. A mold design for forming the imprint lithography stamp and an injection molding process for forming the imprint lithography stamp are also provided.

公开(公告)号：US20210159160A1

公开(公告)日：2021-05-27

申请号：US16886704

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Giback PARK ,  Kyuil CHO ,  Kurtis LESCHKIES ,  Roman GOUK ,  Chintan BUCH ,  Vincent DICAPRIO ,  Bernhard STONAS ,  Jean DELMAS

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/14

Abstract: The present disclosure relates to semiconductor core assemblies and methods of forming the same. The semiconductor core assemblies described herein may be utilized to form semiconductor package assemblies, PCB assemblies, PCB spacer assemblies, chip carrier assemblies, intermediate carrier assemblies (e.g., for graphics cards), and the like. In one embodiment, a silicon substrate core is structured by direct laser patterning. One or more conductive interconnections are formed in the substrate core and one or more redistribution layers are formed on surfaces thereof. The silicon substrate core may thereafter be utilized as a core structure for a semiconductor package, PCB, PCB spacer, chip carrier, intermediate carrier, or the like.

公开(公告)号：US20190273002A1

公开(公告)日：2019-09-05

申请号：US16417124

申请日：2019-05-20

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Jean DELMAS

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677 ,  B08B7/00 ,  H01L21/687 ,  F26B21/14 ,  C11D11/00

Abstract: Embodiments described herein generally relate to a processing chamber incorporating a small thermal mass which enable efficient temperature cycling for supercritical drying processes. The chamber generally includes a body, a liner, and an insulation element which enables the liner to exhibit a small thermal mass relative to the body. The chamber is also configured with suitable apparatus for generating and/or maintaining supercritical fluid within a processing volume of the chamber.

公开(公告)号：US20170098542A1

公开(公告)日：2017-04-06

申请号：US15268180

申请日：2016-09-16

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Jean DELMAS

IPC: H01L21/02 ,  H01L21/687 ,  H01L21/67 ,  B08B3/04

CPC classification number: H01L21/02101 ,  H01L21/02057 ,  H01L21/67034 ,  H01L21/6719 ,  H01L21/68728 ,  H01L21/68785

Abstract: A substrate support apparatus is provided. The apparatus includes a circular base plate and one or more spacers disposed about a circumference of the base plate. The spacers may extend from a top surface of the base plate and a ring body may be coupled to the spacers. The ring body may be spaced from the base plate to define apertures between the base plate and the ring body. One or more support posts may be coupled to the base plate and extend therefrom. The support posts may be coupled to the base plate at positions radially inward from an inner surface of the ring body.

公开(公告)号：US20170098541A1

公开(公告)日：2017-04-06

申请号：US15268162

申请日：2016-09-16

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Jean DELMAS

IPC: H01L21/02 ,  F26B21/14 ,  B08B7/00 ,  F26B5/04

Abstract: A method for processing a substrate is disclosed. The method includes delivering a solvent to a processing chamber and delivering a substrate to the processing chamber. The amount of solvent present in the processing chamber may be configured to submerse the substrate. Liquid CO2 may be delivered to the processing chamber and the liquid CO2 may be mixed with the solvent. Additional liquid CO2 may be delivered to the processing chamber in an amount greater than a volume of the processing chamber to displace the solvent. The liquid CO2 may be phase transitioned to supercritical CO2 in the processing chamber and the substrate may be dried by isothermally depressurizing the processing chamber and exhausting gaseous CO2 from the processing chamber.

公开(公告)号：US20240253968A1

公开(公告)日：2024-08-01

申请号：US18634707

申请日：2024-04-12

Applicant: Applied Materials, Inc.

Inventor： Jean DELMAS ,  Bernard FREY

IPC: B67D7/02 ,  B65D88/74 ,  B67D7/16 ,  B67D7/32 ,  B67D7/36 ,  B67D7/62 ,  B67D7/76 ,  B67D7/78 ,  B67D7/82 ,  H05B1/02

CPC classification number: B67D7/02 ,  B65D88/748 ,  B67D7/16 ,  B67D7/32 ,  B67D7/3272 ,  B67D7/36 ,  B67D7/62 ,  B67D7/76 ,  B67D7/78 ,  B67D7/82 ,  H05B1/0297

Abstract: Methods and systems for the production and delivery of lithium metal of high purity are provided herein. In one or more embodiments, method for flowing liquid lithium to a processing chamber is provided and includes flowing liquid lithium from a lithium refill container to a liquid lithium delivery module, where the liquid lithium delivery module is fluidly coupled to the lithium refill container, and flowing the liquid lithium from the liquid lithium delivery module to the processing chamber. The liquid lithium delivery module contains a lithium storage region operable to store liquid lithium and containing a fluid supply line fluidly coupling an outlet port of a liquid lithium storage tank, and a flow meter positioned downstream from the lithium storage region along the fluid supply line and operable to monitor the flow of the liquid lithium through the fluid supply line.

公开(公告)号：US20220356026A1

公开(公告)日：2022-11-10

申请号：US17721107

申请日：2022-04-14

Applicant: Applied Materials, Inc.

Inventor： Jean DELMAS ,  Kiran VACHHANI ,  Andreas G. HEGEDUS ,  Subramanya P. HERLE

IPC: B65H23/188 ,  B65H23/038

Abstract: The present disclosure generally relates to systems and methods for transporting a web through a web processing apparatus. In one aspect, a web tension adjustment unit for guiding a web. The web tension adjustment unit includes a first guide roller. The first guide roller includes an adjustment unit. The web tension adjustment unit further includes one or more first non-contact sensors positioned to measure displacement data of the web at a first location. The web tension adjustment unit further includes a system controller for controlling the adjustment unit based on the measured displacement data.

公开(公告)号：US20200243345A1

公开(公告)日：2020-07-30

申请号：US16849604

申请日：2020-04-15

Applicant: Applied Materials, Inc.

Inventor： Jean DELMAS ,  Steven VERHAVERBEKE ,  Kurtis LESCHKIES

IPC: H01L21/324 ,  H01L21/67

Abstract: Disclosed herein is an apparatus and method for annealing semiconductor substrates. In one example a temperature-controlled fluid circuit includes a condenser configured to fluidly connect to an internal volume of a processing chamber. The processing chamber has a body, the internal volume is within the body. The condenser is configured to condense a processing fluid into liquid phase. A source conduit includes a first terminal end that couples to a first port on the body of the processing chamber. The source conduit includes a second terminal end. The first terminal end couples to a gas panel. The gas panel is configured to provide a processing fluid into the internal volume of the processing chamber. A gas conduit includes a first end. The first end couples to the condenser and a second end. The second end is configured to couple to a second port on the body of the processing chamber.