公开(公告)号：US20240306262A1

公开(公告)日：2024-09-12

申请号：US18222979

申请日：2023-07-17

Applicant: Applied Materials, Inc.

Inventor： Yao-Hung YANG ,  Shantanu Rajiv GADGIL ,  Kaushik RAO ,  Ngoc LE ,  Jeffrey Donald OLSON

IPC: H05B3/00 ,  B23K1/19 ,  H05B3/02

CPC classification number: H05B3/0047 ,  B23K1/19 ,  H05B3/02

Abstract: Embodiments of lamp housings for a process chamber are provided herein. In some embodiments, a lamp housing for a process chamber includes: a first plate having a plurality of first openings; a copper plate having a plurality of second openings; a plurality of tubes brazed via a braze alloy to the first plate at first ends of the plurality of tubes and brazed to the copper plate via the braze alloy at second ends of the plurality of tubes, wherein the plurality of tubes have central openings that are aligned with the plurality of first openings and the plurality of second openings, and wherein the braze alloy comprises a nickel containing alloy or a copper containing alloy, wherein the copper containing alloy does not include gold; and an annular jacket circumscribing the plurality of tubes and brazed to the first plate via the braze alloy.

公开(公告)号：US20150247237A1

公开(公告)日：2015-09-03

申请号：US14594296

申请日：2015-01-12

Applicant: Applied Materials, Inc.

Inventor： Sungwon HA ,  Kwangduk Douglas LEE ,  Ganesh BALASUBRAMANIAN ,  Juan Carlos ROCHA-ALVAREZ ,  Martin Jay SEAMONS ,  Ziqing DUAN ,  Zheng John YE ,  Bok Hoen KIM ,  Lei JING ,  Ngoc LE ,  Ndanka MUKUTI

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/50

CPC classification number: C23C16/45565 ,  C23C16/4401 ,  C23C16/4585 ,  C23C16/5096 ,  H01J37/32091 ,  H01J37/32449

Abstract: Embodiments described herein relate to a faceplate for improving film uniformity. A semiconductor processing apparatus includes a pedestal, an edge ring and a faceplate having distinct regions with differing hole densities. The faceplate has an inner region and an outer region which surrounds the inner region. The inner region has a greater density of holes formed therethrough when compared to the outer region. The inner region is sized to correspond with a substrate being processed while the outer region is sized to correspond with the edge ring.

Abstract translation: 本文所述的实施例涉及一种用于提高膜均匀性的面板。 半导体处理装置包括具有不同孔洞密度区域的基座，边缘环和面板。 面板具有内部区域和围绕内部区域的外部区域。 当与外部区域相比时，内部区域具有通过其形成的更大密度的孔。 内部区域的尺寸被设计成与被处理的基底相对应，而外部区域的尺寸被设计成与边缘环相对应。