Abstract:
PROBLEM TO BE SOLVED: To provide a method and an apparatus for controlling the temperature of a substrate support.SOLUTION: In some embodiments, an apparatus for controlling the temperature of a substrate support 116 may include a first heat transfer loop 202 and a second heat transfer loop 210. The first heat transfer loop may have a first bath 204 with a first heat transfer fluid at a first temperature. The second heat transfer loop may have a second bath 212 with a second heat transfer fluid at a second temperature. The first and second temperatures may be the same or different. First and second flow controllers 206 and 214 may be provided for respectively providing the first and second heat transfer fluids to the substrate support. One or more return lines may couple one or more outlets of the substrate support to the first and second baths for returning the first and second heat transfer fluids to the first and second baths.
Abstract:
Embodiments disclosed herein relate to a light pipe structure for thermal processing of semiconductor substrates. In one embodiment, a light pipe window structure for use in a thermal process chamber includes a transparent plate, and a plurality of light pipe structures formed in a transparent material that is coupled to the transparent plate, each of the plurality of light pipe structures comprising a reflective surface and having a longitudinal axis disposed in a substantially perpendicular relation to a plane of the transparent plate.
Abstract:
Exhaust systems for substrate process chambers are provided herein. In some embodiments, an exhaust for a process chamber configured to process a substrate having a given width may include a body having an internal cavity and an opening disposed in a first side of the body, the opening fluidly coupled to the internal cavity; a plurality of through holes disposed through a second side of the body, the plurality of through holes fluidly coupled to the internal cavity, wherein the plurality of through holes are disposed symmetrically about the body with respect to a central axis of the body such that the plurality of through holes provide an equal length and pressure drop from the opening to each respective through hole; and a plurality of conduits, each having a first open end respectively coupled to the plurality of through holes.
Abstract:
Methods and apparatus are provided for reducing the thermal signal noise in process chambers using a non-contact temperature sensing device to measure the temperature of a component in the process chamber. In some embodiments, a susceptor for supporting a substrate in a process chamber includes a first surface comprising a substrate support surface; and a second surface opposite the first surface, wherein a portion of the second surface comprises a feature to absorb incident radiant energy.
Abstract:
Apparatus for processing a substrate are provided herein. In some embodiments, a lamphead for use in substrate processing includes a monolithic member having a contoured surface; a plurality of reflector cavities disposed in the contoured surface, wherein each reflector cavity is shaped to act as a reflector or to receive a replaceable reflector for a lamp; and a plurality of lamp passages, wherein each lamp passage extends into the monolithic member from one of the plurality of reflector cavities.