公开(公告)号：US20220275505A1

公开(公告)日：2022-09-01

申请号：US17187218

申请日：2021-02-26

Applicant: Applied Materials, Inc.

Inventor： Chien-Min LIAO ,  Chi-Feng LIU ,  Yi Nung WU ,  Hsiu YANG ,  Yixing LIN ,  Boon Sen CHAN ,  Siamak SALIMIAN

IPC: C23C16/44 ,  H05B1/02 ,  C23C16/455

Abstract: Methods and apparatus for a baking chamber for processing a chamber component are provided herein. In some embodiments, a baking chamber includes: an enclosure defining a first chamber, wherein the first chamber comprises: a first chamber body having a first floor and first sidewalls that couple the first floor to a first lid of the first chamber body to define a first interior volume; a first support disposed in the first interior volume; a first gas line disposed in the first interior volume proximate the first lid; a first showerhead disposed between the first gas line and the first support; a first exhaust coupled to the first floor; and a first heater disposed in the first interior volume between the first support and the first floor; and wherein the enclosure includes a door configured to facilitate transferring the chamber component into and out of the enclosure.

公开(公告)号：US20170260639A1

公开(公告)日：2017-09-14

申请号：US15452062

申请日：2017-03-07

Applicant: Applied Materials, Inc.

Inventor： Yogita PAREEK ,  Laksheswar KALITA ,  Geetika BAJAJ ,  Kevin A. PAPKE ,  Ankur KADAM ,  Bipin THAKUR ,  Yixing LIN ,  Dmitry LUBOMIRSKY ,  Prerna A. GORADIA

IPC: C25D3/44 ,  C25D5/50 ,  H01L21/67 ,  C25D5/18

CPC classification number: C25D3/44 ,  C25D3/66 ,  C25D5/022 ,  C25D5/18 ,  C25D5/48 ,  C25D5/50 ,  C25D11/04 ,  H01L21/67023

Abstract: The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.

公开(公告)号：US20200370174A1

公开(公告)日：2020-11-26

申请号：US16806656

申请日：2020-03-02

Applicant: Applied Materials, Inc.

Inventor： Shuran SHENG ,  Lin ZHANG ,  Jiyong HUANG ,  Joseph C. WERNER ,  Stanley WU ,  Mahesh Adinath KANAWADE ,  Yikai CHEN ,  Yixing LIN ,  Ying MA

IPC: C23C16/44 ,  C01F17/265

Abstract: Embodiments of the present disclosure generally relate to an apparatus and a method for cleaning a processing chamber. In one embodiment, a substrate support cover includes a bulk member coated with a fluoride coating. The substrate support cover is placed on a substrate support disposed in the processing chamber during a cleaning process. The fluoride coating does not react with the cleaning species. The substrate support cover protects the substrate support from reacting with the cleaning species, leading to reduced condensation formed on chamber components, which in turn leads to reduced contamination of the substrate in subsequent processes.

公开(公告)号：US20250073819A1

公开(公告)日：2025-03-06

申请号：US18242184

申请日：2023-09-05

Applicant: Applied Materials, Inc.

Inventor： Chunrong YIN ,  Ching-Pao WANG ,  Joseph LIU ,  Yixing LIN ,  Boon Sen CHAN ,  Siamak SALIMIAN

IPC: B23K26/352 ,  B23K26/082 ,  B23K26/40

Abstract: Methods and apparatus for cleaning a used component from a substrate processing chamber are provided. In some embodiments, the method includes obtaining a used component having a ceramic base and process residue that is generated as a byproduct in the substrate processing chamber and that is in direct contact with the ceramic base; and at least partially removing the process residue by scanning a laser beam across the process residue.

公开(公告)号：US20170299487A1

公开(公告)日：2017-10-19

申请号：US15487213

申请日：2017-04-13

Applicant: Applied Materials, Inc.

Inventor： Jianqi WANG ,  William Ming-ye LU ,  Yixing LIN ,  Kevin A. PAPKE

IPC: G01N15/02 ,  B08B3/12 ,  G01N15/14

CPC classification number: B08B3/12 ,  G01N1/38 ,  G01N2001/028 ,  G01N2001/383 ,  G01N2015/1486

Abstract: The implementations described herein generally relate to 30 nm in-line liquid particle count testing equipment which analyses and cleans semiconductor processing equipment. More specifically, the implementations described relate to a system for diluting, analyzing, and modifying fluids to enable the observation of the contents of the fluids. A dilution sampling tool is coupled with a liquid particle detector for reading the contents of an extraction solution containing particles from semiconductor processing equipment, such as a liner, a shield, a faceplate, or a showerhead, in a cleaning tank. As such, accurate liquid particle readings may be had which reduce oversaturation of the particle detector.

公开(公告)号：US20170260618A1

公开(公告)日：2017-09-14

申请号：US15451995

申请日：2017-03-07

Applicant: Applied Materials, Inc.

Inventor： Laksheswar KALITA ,  Prerna A. GORADIA ,  Geetika BAJAJ ,  Yogita PAREEK ,  Yixing LIN ,  Dmitry LUBOMIRSKY ,  Ankur KADAM ,  Bipin THAKUR ,  Kevin A. PAPKE ,  Kaushik VAIDYA

IPC: C23C8/12 ,  C22F1/16 ,  C23C8/16 ,  C25D3/54 ,  C25D5/50

CPC classification number: C23C8/12 ,  C22F1/16 ,  C23C8/02 ,  C23C8/16 ,  C25D3/54 ,  C25D5/18 ,  C25D5/48 ,  C25D5/50 ,  C25D11/08 ,  C25D11/34

Abstract: The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.