公开(公告)号：US20030213559A1

公开(公告)日：2003-11-20

申请号：US10151722

申请日：2002-05-20

Applicant: Applied Science and Technology, Inc.

Inventor： Daniel Goodman

IPC: H01L021/306 ,  C23C016/00

CPC classification number: H01J37/32935 ,  H01J37/32082 ,  H01J37/3299

Abstract: A method for controlling a plasma used for materials processing includes generating a power for forming an electronegative plasma, detecting a signal that is related to a parameter of the plasma, and modulating the power generated in response to the signal. Modulation of the power causes a reduction in an instability of the parameter of the plasma. An apparatus for controlling a materials processing electronegative plasma includes a signal detector for detecting a signal that is related to a parameter of the plasma, and a power modulator for causing a modulation of the power for forming the plasma in response to the signal.

Abstract translation: 用于控制用于材料处理的等离子体的方法包括产生用于形成电负离子的功率，检测与等离子体的参数相关的信号，以及响应于该信号调制产生的功率。 功率的调制导致等离子体参数的不稳定性的降低。 用于控制材料处理电负性等离子体的装置包括用于检测与等离子体的参数相关的信号的信号检测器和用于响应于该信号而形成等离子体的功率的调制的功率调制器。