Abstract:
The invention concerns a multilayer structure such as a booklet cover paper, in particular for a passport. It comprises a radio frequency identification device (31, 32) having a chip (31), the latter being housed in the thickness of the multilayer structure without creating excess thickness, the materials constituting the various layers of the multilayer structure being selected, as well as the thickness of said layers, such that the cover (20) is resistant to mechanical and thermal impacts, in particular so that it can be subjected to a graining and/or jacketing process by deposition of a heat-transfer film under pressure and/or by lamination when security films are deposited thereon.