HOLLOW POLYMER PARTICLES FOR THERMAL INSULATION
    1.
    发明申请
    HOLLOW POLYMER PARTICLES FOR THERMAL INSULATION 审中-公开
    中空聚合物颗粒用于热绝缘

    公开(公告)号:WO2018071300A1

    公开(公告)日:2018-04-19

    申请号:PCT/US2017/055557

    申请日:2017-10-06

    Applicant: ARKEMA INC.

    Abstract: A thermal insulating additive, product formed therefrom, and method of making the same, wherein the thermal insulating additive comprises a plurality of hollow polymeric particles having an average particle size up to about 0.3 micrometers. The hoi low polymeric particles exhibit a mechanical strength in a compression test up to about 420 psi and a thermal conductivity that is less than 0.150 W/m-k. The hollow polymeric particles are individually formed as an alkaline swellable core that is at least partially encapsulated with two or more shell layers; the alkaline swellable core prior to swelling exhibits an average particle size that is less than about 50 nanometers.

    Abstract translation: 一种绝热添加剂,由其形成的产品及其制造方法,其中所述绝热添加剂包含多个平均粒径高达约0.3微米的中空聚合物颗粒。 该低聚合物颗粒在高达约420psi的压缩测试中表现出机械强度和小于0.150W / m-k的热导率。 中空聚合物颗粒单独形成为至少部分被两个或更多个壳层包封的碱性可膨胀芯; 溶胀之前的碱性可膨胀芯表现出小于约50纳米的平均粒度。

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