公开(公告)号：US20240292517A1

公开(公告)日：2024-08-29

申请号：US18481097

申请日：2023-10-04

Applicant: Asia Pacific Microsystems, Inc.

Inventor： Jer-Wei HSIEH ,  Hung-Lin YIN

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0233 ,  H05K1/024 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/184 ,  H05K2201/0183 ,  H05K2201/0206 ,  H05K2201/083

Abstract: A carrier board includes a substrate having a first substrate surface, a second substrate surface, and a substrate hole that penetrates the first substrate surface and the second substrate surface; a magnet sheath disposed in the substrate hole to cover a hole boundary of the substrate hole, and including a first magnetic surface, a second magnetic surface, and an inner periphery that interconnects the first magnetic surface and the second magnetic surface; a first dielectric isolation layer and a second dielectric isolation layer respectively having outer surfaces facing away from the substrate; and a conductive metal layer covering the inner periphery of the magnet sheath and extending to overlie the outer surfaces of the first dielectric isolation layer and the second dielectric isolation layer.