公开(公告)号：US20160091937A1

公开(公告)日：2016-03-31

申请号：US14497329

申请日：2014-09-26

Applicant: Asia Vital Components Co., Ltd.

Inventor： Ching-Hang Shen ,  Chun-Min Wu

IPC: G06F1/20

CPC classification number: G06F1/203 ,  G06F1/1626

Abstract: A heat dissipation structure for hand-held device includes an element holding member internally defining a receiving space, a base plate held in the receiving space and having a plurality of electronic elements mounted on a top thereof, at least one heat conductive layer provided on one side of the electronic elements opposite to the base plate, and a graphite layer provided on one side of the heat conductive layer opposite to the electronic elements. The heat conductive layer transfers heat produced by the electronic elements to the graphite layer, from where the heat is quickly dissipated into ambient air, enabling upgraded heat dissipation efficiency of the electronic elements.

Abstract translation: 用于手持式装置的散热结构包括内部限定接收空间的元件保持构件，保持在容纳空间中的基板，并且具有安装在其顶部上的多个电子元件，至少一个设置在其上的导热层 电子元件的与基板相对的一侧，以及设置在与电子元件相对的导热层一侧的石墨层。 导热层将由电子元件产生的热量传递到石墨层，从而将热量迅速散发到环境空气中，从而使电子元件的散热效率得以改善。