公开(公告)号：WO2015009775A1

公开(公告)日：2015-01-22

申请号：PCT/US2014/046777

申请日：2014-07-16

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： MAJCHER, Jared P. ,  DRESSER, Timothy M.

IPC: H01R12/52

CPC classification number: H02B1/56 ,  H01L23/473 ,  H01Q21/0087 ,  H01R4/48 ,  H01R12/52 ,  H02B1/20 ,  H05K7/20218 ,  H05K7/20254 ,  H05K7/209 ,  H05K7/20927

Abstract: An integrated DC power delivery system for PCBs is disclosed. In one embodiment, the system includes a compliant mechanical coupling assembly. The system further includes a power distribution interface having power planes configured to receive the DC power via the complaint mechanical coupling assembly upon securing the compliant mechanical coupling to the power distribution interface to provide the needed mechanical support.

Abstract translation: 公开了一种用于PCB的集成直流电力输送系统。 在一个实施例中，系统包括柔性机械联接组件。 该系统还包括配电接口，其具有配置成在将柔性机械联接器固定到配电接口以提供所需的机械支撑时经由投诉机械联接组件接收DC电力的电力平面。

公开(公告)号：WO2015009491A1

公开(公告)日：2015-01-22

申请号：PCT/US2014/045838

申请日：2014-07-09

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： SLIECH, Kevin W. ,  HEDGES, Stephen A. ,  MAJCHER, Jared P.

IPC: H05K7/20

CPC classification number: H02B1/56 ,  H01L23/473 ,  H01Q21/0087 ,  H01R4/48 ,  H01R12/52 ,  H02B1/20 ,  H05K7/20218 ,  H05K7/20254 ,  H05K7/209 ,  H05K7/20927

Abstract: An integrated heat exchanger and power delivery system for high powered electronic modules is disclosed. In one embodiment, the system includes a coolant manifold. The system further includes a heat exchanger and power delivery module. The heat exchanger and power delivery module comprises a plurality of heat exchanger and power delivery elements that are coupled to the coolant manifold. The system furthermore includes a high powered electronic module, wherein the high powered module comprises an array of sub-modules. The array of sub-modules is disposed on the plurality of heat exchanger and power delivery elements. The plurality of heat exchanger and power delivery elements are configured to substantially simultaneously deliver power and extract heat away from the sub-modules.

Abstract translation: 公开了一种用于大功率电子模块的集成热交换器和功率输送系统。 在一个实施例中，系统包括冷却剂歧管。 该系统还包括热交换器和电力输送模块。 热交换器和动力输送模块包括耦合到冷却剂歧管的多个热交换器和动力输送元件。 该系统还包括高功率电子模块，其中高功率模块包括子模块阵列。 子模块阵列设置在多​​个热交换器和电力输送元件上。 多个热交换器和动力输送元件构造成基本上同时地输送动力并将热量从子模块中提取出来。