公开(公告)号：WO2015009582A1

公开(公告)日：2015-01-22

申请号：PCT/US2014/046453

申请日：2014-07-14

Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.

Inventor： SLIECH, Kevin, W. ,  DRESSER, Timothy, M. ,  MAJCHER, Jared, P.

IPC: H05K7/20 ,  F28F7/00

CPC classification number: H02B1/56 ,  H01L23/473 ,  H01Q21/0087 ,  H01R4/48 ,  H01R12/52 ,  H02B1/20 ,  H05K7/20218 ,  H05K7/20254 ,  H05K7/209 ,  H05K7/20927

Abstract: A detachable high powered electronic module of a high powered electronic system capable of receiving high power is disclosed. In one embodiment, the detachable high powered electronic includes a sub-array of the high powered electronic module, a heat exchanger assembly, a power converter module, and a mechanical interface. The mechanical interface is configured to detachably couple the sub-array and the power converter module via the heat exchanger assembly. Further, the detachable sub-array assembly is configured to deliver power received from the power converter module to the sub-array and also to substantially simultaneously extract heat away from the detachable sub-array. [FIG. 3]

Abstract translation: 公开了一种能够接收高功率的大功率电子系统的可拆卸大功率电子模块。 在一个实施例中，可拆卸高功率电子包括高功率电子模块的子阵列，热交换器组件，功率转换器模块和机械接口。 机械接口构造成经由热交换器组件可拆卸地联接子阵列和功率转换器模块。 此外，可拆卸子阵列组件被配置为将从功率转换器模块接收的功率传送到子阵列，并且还基本上同时地将热量从可拆卸子阵列提取出来。 [图。 3]