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1.
公开(公告)号:AU2014361093B2
公开(公告)日:2016-12-15
申请号:AU2014361093
申请日:2014-11-20
Applicant: BAE SYSTEMS PLC
Inventor: BALMOND MARK DAVID , PARFITT ALEXANDER ROY , PANAGHISTON GARY DAVID , TWEEN LARRY BRIAN , FIGGURES CHRISTOPHER COLIN
Abstract: A sensor (1) and a method of manufacturing the sensor (1), the sensor (1) including a number of metallic strips (5,6,7) mounted on a non-conducting substrate (4) and a module (3) for forming electrical connections to the strips (5,6,7) whereby to enable communication between the strips (5,6,7)and monitoring equipment for the sensor (4), the module including a number of wire connections (16), the method including the steps of encapsulating the wire connections within a flexible chemical and heat resistant sealing compound, and subsequently, encapsulating the flexible sealing compound within a second sealing compound (34) by an injection moulding process.
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公开(公告)号:GB2522114A
公开(公告)日:2015-07-15
申请号:GB201420633
申请日:2014-11-20
Applicant: BAE SYSTEMS PLC
Inventor: BALMOND MARK DAVID , FIGGURES CHRISTOPHER COLIN , PARFITT ALEXANDER ROY , PANAGHISTON GARY DAVID , TWEEN LARRY BRIAN
IPC: G01N17/04
Abstract: A method of manufacturing a sensor 1, the sensor including a number of metallic strips 5-7 mounted on a non-conducting substrate 4 and a module 3 for forming electrical connections to the strips whereby to enable communication between the strips and monitoring equipment for the sensor, the module including a number of wire connections 16, the method including the steps of encapsulating the wire connections within a flexible chemical and heat resistant sealing compound, and subsequently, encapsulating the flexible sealing compound within a second sealing compound 34 by an injection moulding process. The second sealing compound is an aircraft sealant and the sensor is a corrosion sensor. An injection mould for injection moulding the sealing compound includes a bed and first and second upper portions defining a mould cavity where the sensor unit is placed for applying the final sealant.
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公开(公告)号:AU2021281090A1
公开(公告)日:2023-01-05
申请号:AU2021281090
申请日:2021-05-26
Applicant: BAE SYSTEMS PLC
Inventor: ELEY REBECKA , BALMOND MARK DAVID , FIGGURES CHRISTOPHER COLIN , STURLAND IAN MICHAEL , CHURCH SIMON ROBERT
IPC: G01N17/04
Abstract: Specimens for evaluating corrosion protection of substrates due, at least in part, to coatings applied thereupon are described. A specimen (1) comprises: a first coating (10), comprising a first set of layers (11) including a first layer (11A), on a first substrate (12); and a first set of perforations (100), including a first perforation (100A) and a second perforation (100B), in the first coating (10), wherein the first perforation (100A) has a first depth D1 through the first coating (10) and a first dimension W1 transverse to the first depth, wherein the second perforation (100B) has a second depth D2 through the first coating (10) and a second dimension W2 transverse to the second depth D2 and wherein the first dimension W1 and the second dimension W2 are different.
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公开(公告)号:GB2522114B
公开(公告)日:2016-04-06
申请号:GB201420633
申请日:2014-11-20
Applicant: BAE SYSTEMS PLC
Inventor: BALMOND MARK DAVID , FIGGURES CHRISTOPHER COLIN , PARFITT ALEXANDER ROY , PANAGHISTON GARY DAVID , TWEEN LARRY BRIAN
IPC: G01N17/04
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5.
公开(公告)号:DK3080584T3
公开(公告)日:2019-12-02
申请号:DK14799827
申请日:2014-11-20
Applicant: BAE SYSTEMS PLC
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6.
公开(公告)号:AU2014361093A1
公开(公告)日:2016-06-09
申请号:AU2014361093
申请日:2014-11-20
Applicant: BAE SYSTEMS PLC
Inventor: BALMOND MARK DAVID , PARFITT ALEXANDER ROY , PANAGHISTON GARY DAVID , TWEEN LARRY BRIAN , FIGGURES CHRISTOPHER COLIN
Abstract: A sensor (1) and a method of manufacturing the sensor (1), the sensor (1) including a number of metallic strips (5,6,7) mounted on a non-conducting substrate (4) and a module (3) for forming electrical connections to the strips (5,6,7) whereby to enable communication between the strips (5,6,7)and monitoring equipment for the sensor (4), the module including a number of wire connections (16), the method including the steps of encapsulating the wire connections within a flexible chemical and heat resistant sealing compound, and subsequently, encapsulating the flexible sealing compound within a second sealing compound (34) by an injection moulding process.
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