1.
    发明专利
    未知

    公开(公告)号:AT348861T

    公开(公告)日:2007-01-15

    申请号:AT02783027

    申请日:2002-10-29

    Applicant: BASF AG

    Abstract: The present invention relates to molding compositions comprising A) from 40 to 99% by weight of at least one epoxy resin, B) from 1 to 60% by weight of at least one polyarylene ether sulfone containing side- or end-groups selected from the group consisting of carboxy groups and anhydride groups, C) from 0 to 60% by weight of at least one polyarylene ether sulfone containing essentially no side- or end-groups selected from the group consisting of carboxy and anhydride groups, D) from 0 to 60% by weight of at least one filler, and E) from 0 to 40% by weight of one or more various additives, where the percentages by weight of components A to E together give 100%, and also to a process for preparing these molding compositions, and to their use, and to moldings obtainable therefrom.

    2.
    发明专利
    未知

    公开(公告)号:DE50209035D1

    公开(公告)日:2007-02-01

    申请号:DE50209035

    申请日:2002-10-29

    Applicant: BASF AG

    Abstract: The present invention relates to molding compositions comprising A) from 40 to 99% by weight of at least one epoxy resin, B) from 1 to 60% by weight of at least one polyarylene ether sulfone containing side- or end-groups selected from the group consisting of carboxy groups and anhydride groups, C) from 0 to 60% by weight of at least one polyarylene ether sulfone containing essentially no side- or end-groups selected from the group consisting of carboxy and anhydride groups, D) from 0 to 60% by weight of at least one filler, and E) from 0 to 40% by weight of one or more various additives, where the percentages by weight of components A to E together give 100%, and also to a process for preparing these molding compositions, and to their use, and to moldings obtainable therefrom.

    RESINAS EPOXICAS MODIFICADAS.
    3.
    发明专利

    公开(公告)号:ES2278983T3

    公开(公告)日:2007-08-16

    申请号:ES02783027

    申请日:2002-10-29

    Applicant: BASF AG

    Abstract: Una composición de moldeamiento que comprende A) de 40 hasta 99% en peso de al menos una resina epóxica, B) de 1 hasta 60% en peso de al menos una sulfona de éter poliarilénico que comprende grupos laterales o extremos seleccionados de un grupo consistente de grupos carboxílicos y anhídridos, C) si es apropiado, al menos una sulfona de éter poliarilénico que no comprende esencialmente grupos laterales o extremos seleccionados del grupo consistente de grupos carboxílicos y anhídridos, D) si es apropiado, al menos una substancia de relleno, y E) de 0 hasta 40% en peso de uno o más aditivos, donde los porcentajes en peso de los componentes A hasta E dan junto 100%.

    4.
    发明专利
    未知

    公开(公告)号:DE10155157A1

    公开(公告)日:2003-05-22

    申请号:DE10155157

    申请日:2001-11-12

    Applicant: BASF AG

    Abstract: The invention relates to moulding materials containing A) between 40 and 99 wt. % of at least one epoxy resin, B) between 1 and 60 wt. % of at least one polyarylene ether sulfone containing side groups or terminal groups selected from the group of carboxyl and anhydride groups, C) between 0 and 60 wt. % of at least one polyarylene ether sulfone containing essentially no side groups or terminal groups selected from the group of carboxyl and anhydride groups, D) between 0 and 60 wt. % of at least one filling material, and E) between 0 and 40 wt. % of one addition agent or a plurality of different addition agents, the total weight percent of constituents A to E amounting to 100 %. The invention also relates to a method for producing said moulding materials, to the use thereof and to moulded parts which can be obtained from the inventive moulding materials.

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