公开(公告)号：DE4243463A1

公开(公告)日：1994-03-03

申请号：DE4243463

申请日：1992-12-22

Applicant: BASF AG

Inventor： GRUNZE MICHAEL PROF DR ,  BUCK MANFRED DR ,  FISCHER JUERGEN

IPC: C08G73/10 ,  C08L79/08 ,  C23C14/12 ,  C23C14/20 ,  B32B15/08 ,  B32B27/28 ,  C08G75/14 ,  C09D179/08

Abstract: Polyimide of formula (I) is new; n = 30-35. USE/ADVANTAGE - The invention provides a new polyimide with the advantages of other polyimides, but which also undergoes defined coordinate bonding with metal substrates with cleavage of the S-S bond, resulting in very good adhesion to metals such as Au, Ag, Fe etc. without using an additional coupling agent, as required e.g. for electronics applications. In an example, a clean gold substrate was immersed for 10 hrs. in a 1-mM soln. of DAPS in ethanol, then rinsed under nitrogen with ethanol; the coated substrate was placed in a vacuum chamber and coated with PMDA and 4,4'-oxydianiline (ODA) by vapour deposition from 2 Knudsen cells, and the system was then imidised by heating at 250 deg. C for several hrs. The PMDA/ODA polyimide film, which does not normally react with gold, was coordinatively bonded to the surface via the DAPS mols.