5.
    发明专利
    未知

    公开(公告)号:DE1570311A1

    公开(公告)日:1970-06-04

    申请号:DE1570311

    申请日:1965-10-29

    Applicant: BASF AG

    Abstract: 1,159,599. Stabilizing polyamides. BADISCHE ANILIN- & SODA-FABRIK A.G. 28 Oct., 1966 [29 Oct., 1965], No. 48418/66. Heading C3R. Polyamides are stabilized against heat and light by incorporating 0À05 to 2À5 wt. per cent of an inorganic iodide and 0À01 to 0À5 wt. per cent of a copper complex containing the grouping wherein each R is independently H or an unsubstituted or hydroxy-, alkoxy- or halosubstituted and X is a radical having 2 to 12 atoms in the chain linking the two N atoms. Various compounds are mentioned. In the examples potassium iodide and the copper salt of tetramethylene-bis (iminophenylacetic acid) is incorporated during the polymerization of nylon 6 or 66/6 of K-values from 62 to 86.

    8.
    发明专利
    未知

    公开(公告)号:DE1221796B

    公开(公告)日:1966-07-28

    申请号:DEB0079872

    申请日:1964-12-23

    Applicant: BASF AG

    Abstract: Mouldings are prepared from elastomers containing urethane groups and/or urea and/or semicarbazide groups. The elastomers are prepared by reacting a polyester having at least two hydroxyl groups prepared from adipic acid and a mixture of 45-90% by wt. 1,6-hexanediol and 10-55% by wt. 2,2-dimethyl, 1,3-hexanediol, first with a polyisocyanate and then with a chain extender. The process may be carried out in the presence of an unreactive polar solvent. Up to 10% by wt. of the adipic acid may be replaced by other dicarboxylic acids, e.g. sebacic, pimelic, suberic or isophthalic acids.

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