公开(公告)号：DE59802999D1

公开(公告)日：2002-03-21

申请号：DE59802999

申请日：1998-08-01

Applicant: BASF AG

Inventor： KELLER DR ,  SCHAUHOFF DR ,  DORN DR ,  ALT HARTMUT ,  MICHELCHEN DIETRICH

IPC: B29C47/00 ,  B29K59/00 ,  C08K5/14 ,  C08K5/37 ,  C08L59/00

Abstract: A polyoxymethylene moulding composition (I) comprises (A) a polyoxymethylene homo- and/or copolymer; (B) conventional additives; and (C) 0.01-2 parts weight (pts. wt.) (w.r.t. (A) + (B)) of a polymeric additive to improve thermal stability, consisting of a copolymer prepared by polymerisation of (C1) 60-90 pts. wt. of a (methy)acrylate; (C2) 10-40 pts. wt. of a (meth)acrylamide; (C3) 0.2-5 pts. wt. of a molecular weight regulator (w.r.t. 100 pts. wt. (C1) and (C2)); and (C4) upto 2 pts. wt. of a lipophilic radical polymerisation initiator (w.r.t. 100 pts. wt. (C1) and (C2)). Also claimed are (i) production of a moulding article or film from (I) by melting and mixing the components in an extruder at 150-260 degrees C and processing to produce a reinforced or non-reinforced article or film; and (ii) the resulting moulded article, semi-finished product or film.