5.
    发明专利
    未知

    公开(公告)号:SE7508878L

    公开(公告)日:1976-02-10

    申请号:SE7508878

    申请日:1975-08-06

    Applicant: BASF AG

    Abstract: In the prodn. of relief structures by applying a film of radiation-sensitive soluble polymer precursors (I) to a substratet, exposing through a negative original, dissolving or peeling off the unexposed areas and opt. tempering the relief structures, using polyadducts or polycondensates of polyfunctional carbo or hetero-cyclic cpds. (II) with radiation-sensitive gps. R with diamines (IIIa), diisocyanates (IIIb). bis-acid chlorides (IIIC) or dicarboxylic acids (IIId) as (I), in which (II) contains 2 COOH, COCl, NH2, NCO or OH gps. suitable for addn. or condensn. reactions and, partly in the ortho- or peri-position to these, radiation-reactive gps., bound ester-wise to carboxyl gps., of the formula: (in which R is oxyalkyl; R1 is alkyl, phenyl, alkoxyphenyl, halophenyl; R2 is H, Cl, alkyl, alkoxy; R3 is a carbo- or hetero-cyclic aromatic gp., bound via a C atome and (III) contain cyclic structural element(s), as parent patent, (I) are prepd. in PO(NMe2)3 (IV) soln. (I) are ued in prodn. of protective films on semiconductors, solder-resistant films on multi-layer circuits, miniaturised insulating films, laminated and printed circuits, visible images and high-quality printing plates.

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