公开(公告)号：DE19930527A1

公开(公告)日：2001-01-04

申请号：DE19930527

申请日：1999-07-01

Applicant: BASF AG

Inventor： WEBER MARTIN ,  HENNING INGOLF

IPC: C08K5/092 ,  C08K5/526 ,  C08L51/00 ,  C08L67/02 ,  C08L69/00 ,  C08L67/00 ,  C08K5/5393 ,  B62D29/04

Abstract: The invention relates to thermoplastic molding compounds that contain A) 1 to 97.85 % by weight of at least one thermoplastic polyester, B) 1 to 97.85 % by weight of at least one polycarbonate, C) 1 to 50 % by weight of a rubber-elastic polymer, D) 0.1 to 5 % by weight of a phosphorous stabilizer, E) 0.05 to 2 % by weight of an organic acid, F) 0 to 60 % by weight of further additives. The weight percentages of the components A) to F) add up to 100 %.