3.
    发明专利
    未知

    公开(公告)号:FR1214684A

    公开(公告)日:1960-04-11

    申请号:FR1214684D

    申请日:1959-01-29

    Applicant: BASF AG

    Abstract: Stress-free homogeneous flat plates or films of polyamides are made by subjecting a flat plate or film made from a film-forming interpolyamide, obtained by polycondensation of at least two different compounds forming linear polyamides, to a treatment with a swelling agent and pressing the plate or film thus treated at a temperature between 40 DEG C. and the melting point of the polyamide without substantially affecting the dimensions of the plate or film. Specified compounds forming linear polyamides which may be used are the diamine salts of dicarboxylic acids, e.g. hexamethylenediamine adipate and diaminodicyclohexylmethane adipate, and the lactams of o -aminocarboxylic acids, e.g. e -caprolactam. The polyamides may also contain hetero atoms in the molecule, e.g. oxygen atoms, or include side chains, e.g. alkyl groups. Specified swelling agents include aliphatic and cycloaliphatic mono-, di and tri-hydroxy compounds with up to 10 carbon atoms, e.g. methanol, ethanol, propanol, ethylene glycol, 1,4-butanediol, glycerin, 1,3,4-butanetriol or p cyclohexanol, and water. Mixtures of these compounds may also be used, as may also polyethylene oxides with a polymer chain length of up to 100 carbon atoms, either by themselves or in admixture with liquid halogen-carbon compounds, e.g. carbon tetrachloride and tetrachloroethylene, or with liquid hydrocarbon halides, e.g. chloroform, ethylene chloride and trichloroethylene, or with liquid aromatic hydrocarbons, e.g. benzene, toluene and xylene. The flat polyamide plate or film subjected to the treatment may contain a photosensitizing agent, or alternatively plates or films may first be treated as described above and then further treated with a solution which contains a photo-sensitizing agent and which makes the polyamide receptive to the latter. If desired, plates or films may be treated with the swelling agent, and the partly dissolved surface of the plate stripped off before the plate is pressed.

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