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公开(公告)号:JPH0245505A
公开(公告)日:1990-02-15
申请号:JP16097189
申请日:1989-06-26
Applicant: BASF AG
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2.
公开(公告)号:JPS63286292A
公开(公告)日:1988-11-22
申请号:JP10152388
申请日:1988-04-26
Applicant: BASF AG
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公开(公告)号:JPS5577739A
公开(公告)日:1980-06-11
申请号:JP13710879
申请日:1979-10-25
Applicant: BASF AG
Inventor: RUDORUFU BIBIARU , GIYUNTERU WARUBIRIHI , HORUSUTO TORATSUPU
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4.
公开(公告)号:JPS63286291A
公开(公告)日:1988-11-22
申请号:JP10152288
申请日:1988-04-26
Applicant: BASF AG
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5.
公开(公告)号:JPS56127698A
公开(公告)日:1981-10-06
申请号:JP1587981
申请日:1981-02-06
Applicant: BASF AG
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公开(公告)号:JPH0233760B2
公开(公告)日:1990-07-30
申请号:JP6078280
申请日:1980-05-09
Applicant: BASF AG
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公开(公告)号:JPH01148492A
公开(公告)日:1989-06-09
申请号:JP25218788
申请日:1988-10-07
Applicant: BASF AG
Inventor: EDOWAADO MAIKERU DEKUSUHAIMAA , NORUBERUTO GURAIFU , CHIYUNNII CHIYAN , HORUSUTO TORATSUPU , GIYUNTAA GOOTSUMAN , KURAUSU GURAAZERU
Abstract: PURPOSE: To obtain a flux or remelting liquid for circuit board production which enables safe operation and has a high flash point by using a specific water-soluble alkyleneoxide-adduct for the flux or the remelting liquid. CONSTITUTION: The water-soluble alkyleneoxide-adduct expressed by formulas I, II or III is used as a basic material for the flux or the remelting liquid at the time of circuit board production. In the formulas I to III, R is the compd. expressed by formula IV; R is H, CH3 , C2 H5 or the like; A is -CH2 - or the like; (n) signifies 2 or 3; (m) 1 or 2; (p) 3 to 15; (q) 0 or 1. This alkyleneoxide- adduct is used as a solvent for tin coating or as a remelting agent in IR remelting.
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公开(公告)号:JPS6057057B2
公开(公告)日:1985-12-13
申请号:JP13710879
申请日:1979-10-25
Applicant: BASF AG
Inventor: RUDORUFU BIBIARU , GYUNTERU WARUBIRIHI , HORUSUTO TORATSUPU
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公开(公告)号:JPS55152798A
公开(公告)日:1980-11-28
申请号:JP6078280
申请日:1980-05-09
Applicant: BASF AG
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