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    THERMOPLASTIC MOULDING COMPOSITION FOR THE PRODUCTION OF MOULDINGS THAT CAN BE ELECTROPLATED
    1.
    发明申请
    THERMOPLASTIC MOULDING COMPOSITION FOR THE PRODUCTION OF MOULDINGS THAT CAN BE ELECTROPLATED 审中-公开
    热塑性成型材料用于生产电镀铝TRIMS

    公开(公告)号：WO2008015169A3

    公开(公告)日：2008-04-10

    申请号：PCT/EP2007057755

    申请日：2007-07-27

    Applicant: BASF AG ,  LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  WAGNER NORBERT ,  KIEBURG CHRISTOFFER ,  JOSHI KETAN

    Inventor： LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  WAGNER NORBERT ,  KIEBURG CHRISTOFFER ,  JOSHI KETAN

    IPC: C08K7/24 ,  C08K3/08 ,  C23C18/00

    CPC classification number: C25D7/08 ,  C08K3/041 ,  C08K3/08 ,  C08K3/18 ,  C08K2201/008 ,  C08L53/02 ,  C23C18/1641 ,  C23C18/2066 ,  C23C18/31 ,  C25D5/54 ,  C25D7/00

    Abstract: The present invention relates to a thermoplastic moulding composition for the production of mouldings that can be metalized by a currentless and/or electroplating method, comprising, based on the total weight of components A, B, C, D and E, which gives a total of 100% by weight, a from 20 to 98% by weight of a thermoplastic polymer as component A, b from 1 to 30% by weight of carbon nanotubes as component B, c from 1 to 70% by weight of electrically conductive particles whose average particle diameter is from 0.01 to 100 µm as component C, d from 0 to 10% by weight of a dispersing agent as component D, and e from 0 to 40% by weight of fibrous or particulate fillers or mixtures of these as component E. The invention further relates to methods for the production of mouldings metalized by a currentless and/or electroplating method, to metalized mouldings, to the use of metalized mouldings, and also to electrically conducting components, EMI shielding systems, such as absorbers, attenuators or reflectors for electromagnetic radiation, and to gas barriers and decorative parts comprising these articles.

    Abstract translation: 本发明涉及热塑性模塑组合物电解生产和/或电metallisable模制品，其特征在于，基于组分A，B，C，d和E，其给出的合计100重量％，20至98重量的总重量 的热塑性聚合物作为组分A的％，b为1至30重量碳纳米管作为组分b的％，c是1〜70重量具有0.01至100微米的平均粒径的导电粒子，作为组分C的％，d 0至10重量分散剂作为组分d和e的％为0〜40重量的纤维状或颗粒状填料或其混合物作为组分E.本发明还涉及用于生产电和/或电解镀金属模制品的方法，金属化的％ 模制部件，使用金属化的模制零件，以及导电部件，EMI屏蔽，例如吸收剂，阻尼器或反射器的电磁辐射，气体阻隔性，以及 包含这些物体的装饰部件。

    ELECTROPLATING DEVICE AND METHOD
    2.
    发明申请
    ELECTROPLATING DEVICE AND METHOD 审中-公开
    DEVICE AND METHOD FOR电镀层

    公开(公告)号：WO2007118875A2

    公开(公告)日：2007-10-25

    申请号：PCT/EP2007053707

    申请日：2007-04-17

    Applicant: BASF AG ,  LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  POHL GERT ,  WAGNER NORBERT

    Inventor： LOCHTMAN RENE ,  KACZUN JUERGEN ,  SCHNEIDER NORBERT ,  PFISTER JUERGEN ,  POHL GERT ,  WAGNER NORBERT

    IPC: C25D5/54 ,  C25D17/00 ,  C25D17/12

    CPC classification number: C25D17/14 ,  C25D5/06 ,  C25D5/54 ,  C25D7/0621 ,  C25D17/005 ,  C25D17/12 ,  H05K3/241

    Abstract: The invention relates to a device for electroplating at least one electrically conductive substrate (8), or an electrically conductive structure situated on a non-conductive substrate (8). Said device comprises at least one bath, an anode and a cathode (2). The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least one strip (2) with at least one electrically conductive segment (12) and is guided around at least two rotating shafts (3). The invention also relates to a method for electroplating at least one substrate that is carried out in a device according to the invention. According to said method, to produce the coating, the strip lies on the substrate and circulates at a speed corresponding to the speed at which the substrate is conveyed through the bath. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support.

    Abstract translation: 本发明涉及一种用于至少一个导电基材（8）或不导电的基底上（8），包括至少一个浴，一个阳极和一个阴极（2）一种导电图案的电镀涂层，其中所述浴至少 包含含有金属离子的金属的盐的电解质溶液是从沉积在衬底的导电表面，而阴极被带入与所述表面接触到待涂覆的基材和所述衬底通过所述浴输送。 阴极包括至少一条带（2）与被引导围绕至少一个导电部分（12）的至少两个可转动的轴（3）。 此外，本发明涉及一种用于至少一个基板，其在根据本发明的装置中进行，其中，对于涂覆该带被支撑在基板上，并在对应于所述速度在该基板通过该浴传递的圆周速度旋转的电解涂覆的方法 ， 最后，本发明还可以根据本发明的用于导电结构的不导电的载体上电解涂覆涉及一种使用该装置。

    METHOD FOR PRODUCTING STRUCTURED ELECTRICALLY CONDUCTIVE SURFACES
    8.
    发明专利
    METHOD FOR PRODUCTING STRUCTURED ELECTRICALLY CONDUCTIVE SURFACES 未知

    公开(公告)号：CA2675033A1

    公开(公告)日：2008-07-24

    申请号：CA2675033

    申请日：2008-01-17

    Applicant: BASF AG

    Inventor： KACZUN JUERGEN ,  WAGNER NORBERT ,  PFISTER JUERGEN ,  LOCHTMAN RENE

    IPC: H05K3/02 ,  H05K1/09

    Abstract: Disclosed is a method for producing structured, electrically conductive s urfaces on a substrate. Said method comprises the following steps: a) a base layer containing particles that can be coated in an electroless manner and/ or be electro-plated is structured on the substrate by removing the base lay er according to a predefined structure with the help of a laser; b) the surf ace of the particles that can be coated in an electroless manner and/or be e lectro-plated is activated; and c) an electrically conductive coating is app lied to the structured base layer.

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