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1.
公开(公告)号:DE2133045A1
公开(公告)日:1973-01-18
申请号:DE2133045
申请日:1971-07-02
Applicant: BASF AG
Abstract: Comminuted wood chips are impregnated with a mixture of the aqueous bonding agent and fine particles of expanded mica (vermiculite) and then heat pressed to form the panels with improved rigidity and reduced swelling properties. Pref. the expanded mica has a granule size distribution of 0.0001-0.5 mm with an av. granule size of 0.01-0.1 mm.
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公开(公告)号:DE2861866D1
公开(公告)日:1982-07-15
申请号:DE2861866
申请日:1978-10-06
Applicant: BASF AG
Inventor: BRUNNMUELLER FRITZ DR , MAYER HOHANN DR , LEHMANN GERHARD J , WITTMANN OTTO , BOLZ WERNER , KAESBAUER FRIEDRICH DR
IPC: C08G12/12 , C08G12/38 , C09J161/24 , C09J161/30 , C09J3/16
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