公开(公告)号：DE59700853D1

公开(公告)日：2000-01-20

申请号：DE59700853

申请日：1997-04-17

Applicant: BASF AG

Inventor： GRUTKE STEFAN ,  COMBA PETER ,  KATSICHTIS CHARIS

IPC: C07F9/50 ,  C08K5/00 ,  C08K5/50 ,  C08L77/00

Abstract: PCT No. PCT/EP97/01910 Sec. 371 Date Oct. 15, 1998 Sec. 102(e) Date Oct. 15, 1998 PCT Filed Apr. 17, 1997 PCT Pub. No. WO97/40100 PCT Pub. Date Oct. 30, 1997A thermoplastic molding material comprising a mixture of a polyamide and a stabilizing amount of a copper compound obtained by reacting a copper(I) salt with a phosphine chelate ligand containing at least 2 phosphorous atoms.

公开(公告)号：DE19615484A1

公开(公告)日：1997-10-23

申请号：DE19615484

申请日：1996-04-19

Applicant: BASF AG

Inventor： GRUTKE STEFAN DR ,  COMBA PETER PROF ,  KATSICHTIS CHARIS

IPC: C07F9/50 ,  C08K5/00 ,  C08K5/50 ,  C08L77/00 ,  C08K5/56 ,  C08J3/20 ,  C08J5/00 ,  C08J5/18 ,  D01F6/60

Abstract: Thermoplastic moulding materials contain 30 to 10 % by weight of a mixture of polyamide and a stabilising amount of a copper compound obtained by reacting cuprous salt with phosphine chelate ligands, and 0 to 70 % by weight other additives.