公开(公告)号：AU2003293875A1

公开(公告)日：2004-07-09

申请号：AU2003293875

申请日：2003-12-13

Applicant: BASF AG

Inventor： OYAMA HIDEKO ,  INOUE TAKASHI ,  OUGIZAWA TOSHIAKI ,  KITAGAWA TOMOKI ,  WEBER MARTIN ,  BRUCHMANN BERND

IPC: C08J5/00 ,  C08L9/02 ,  C08L21/00 ,  C08L25/00 ,  C08L51/04 ,  C08L55/02 ,  C08L67/03

Abstract: Thermoplastic molding compositions, comprising: A) at least one rubber-free copolymer in which no hydroxyl group, acid group, amino group, or anhydride group is present, based on at least one vinylaromatic monomer (a1) and at least one comonomer (a2), B) at least one rubber-free polymer in which at least one hydroxyl group, acid group, or amidno group is present, C) from 3 to 50% by weight, based on the total weight of the molding composition, of at least one rubber, D) at least one terpolymer, C)obtainable from d1) at least one vinylaromatic monomer, d2) at least one C 1 -C 4 -alkyl (meth)acrylate or (meth)acrylonitrile, and d3) from 0.4 to 4% by weight, based on the total weight of the teruolymer, of at least one monomer in which an alphabeta-unsaturatedl anhydride is present, and E) at least one compound having at least two isocyanate groups.