公开(公告)号：DE2351606A1

公开(公告)日：1975-04-24

申请号：DE2351606

申请日：1973-10-15

Applicant: BASF AG

Inventor： MARX MATTHIAS DIPL-CHEM DR ,  SANDER HANS DIPL-CHEM DR ,  SCHNEIDER KURT DIPL-CHEM DR ,  SPOOR HERBERT DIPL-CHEM DR

IPC: C08L33/06 ,  C08L61/00 ,  C08L63/00 ,  C09D133/06 ,  C09D3/80 ,  C09D5/00

公开(公告)号：DE2635177B1

公开(公告)日：1978-02-16

申请号：DE2635177

申请日：1976-08-05

Applicant: BASF AG

Inventor： KROKER RUPRECHT DIPL-ING DR ,  SANDER HANS DIPL-CHEM DR

IPC: C08L63/00 ,  C09D125/14 ,  C09D133/02 ,  C09D133/06 ,  C09D163/00 ,  C09D3/81

Abstract: The invention relates to baking finishes of low solvent content, consisting essentially of an acrylate resin, an epoxy resin and a mixture of organic solvents, with or without pigment, catalyst and other conventional auxiliaries, in which the acrylate resin is a copolymer which contains from 10 to 35% by weight of alpha , beta -olefinically unsaturated carboxylic acids as copolymerized units, has a very low K value and has an acid number of from 70 to 250 mg of KOH/g, the epoxy resin contains at least 2 oxirane groups per molecule and the mixture of organic solvents is a mixture of from 20 to 80% by weight of a solvent having a boiling point of from 100 DEG to 280 DEG C and a dielectric constant of from 2 to 4.99, and from 80 to 20% by weight of a solvent having a boiling point of from 80 DEG to 200 DEG C and a dielectric constant of from 5 to 27. The weight ratio of acrylate resin to epoxy resin is from 9:1 to 6:4.