Abstract:
The present invention relates to a polymer film (P), comprising at least one copolyamide, wherein the copolyamide has been prepared by polymerizing at least one lactam (A) and a monomer mixture (M). The present invention further relates to a process for producing the polymer film (P) and to the use of the polymer film (P) as packaging film.
Abstract:
The invention relates to the use of thermoplastic molding compositions comprising D) from 30 to 99% by weight of a thermoplastic polyamide E) from 0.01 to 10% by weight of an organic isocyanate or diisocyanate, or a mixture of these F) from 0 to 60% by weight of other additional substances, where the sum of the percentages by weight of A) to C) is 100%, for the production of moldings of any type with improved haze (measured in accordance with ASTM D1003) and/or improved clarity (measured in accordance with ASTM D1003) and/or increased laser transparency (measured at a wavelength of 1064 nm by means of a thermoelectric power measurement).
Abstract:
The present invention relates to the use of polyolefin copolymers A) for reducing color changes during the heating of polymer compositions which contain at least one thermoplastic polyamide B).
Abstract:
The present invention relates to a process for preparing an aliphatic or semiaromatic polyamide oligomer, in which an aqueous composition of the monomers is subjected to an oligomerization at elevated temperature and elevated pressure and the oligomerization output is preferably subjected to an expansion.
Abstract:
The present invention relates to the use of at least one urea compound of the formula I where x is 1, 2 or 3; R1 and R2 are selected from hydrogen, linear C1-C7-alkyl, branched C3-C10-alkyl, unsubstituted or substituted C3-C12-cycloalkyl, unsubstituted or substituted C3-C12-cycloalkyl-C1-C4-alkyl, unsubstituted or substituted aryl and unsubstituted or substituted aryl-C1-C4-alkyl; and Z is selected from C3-C10-alkanediyl, unsubstituted or substituted arylene, unsubstituted or substituted arylene-C1-C4-alkylene-arylene, unsubstituted or substituted heteroarylene, unsubstituted or substituted heteroarylene-C1-C4-alkylene-heteroarylene, unsubstituted or substituted C5-C8-cycloalkylene, unsubstituted or substituted C5-C8-cycloalkylene-C1-C4-alkylene-C5-C8-cycloalkylene, unsubstituted or substituted heterocycloalkylene and unsubstituted or substituted heterocycloalkylene-C1-C4-alkylene-heterocycloalkylene for improving at least one solid state property of a polyamide resin. The solid state property is preferably selected from mechanical properties and gloss.
Abstract:
The present invention relates to semi-aromatic copolyamides having a high glass transition temperature and a high degree of crystallinity, to a polyamide molding compound containing said semi-aromatic copolyimide and to the use of the semi-aromatic copolyamides and of the polyamide molding compounds.
Abstract:
The present invention relates to a process for preparing an aliphatic or semiaromatic polyamide, in which a polyamide prepolymer is subjected to a solid state polymerization.
Abstract:
The present invention relates to a process for preparing an aliphatic or semiaromatic polyamide, in which a polyamide prepolymer is subjected to a solid state polymerization.
Abstract:
The present invention relates to a polyamide composition (PC) which comprises at least one polyamide (P) and at least one additive (A). The present invention further relates to the use of the polyamide composition (PC) in a selective laser sintering process, in an injection molding process, for producing molded articles and in an extrusion process.