Abstract:
The present invention relates to methods of separating adhesively bonded substrates by irradiation with microwaves, with one of the substrates consisting partly or entirely of a material which decomposes at least partially on absorption of microwave radiation, and the use of these methods for the parting of specific substrates.
Abstract:
With respect to a method for reducing the thermal conductivity and for increasing the thermoelectric efficiency of thermoelectric materials based on lead chalcogenides or skutterudites, the thermoelectrical materials are extruded at a temperature below their melting point and a pressure in the range of 300 to 1000 MPa.
Abstract:
A p-conductive or n-conductive semiconductor material contains a Ge-, Co-, Fe- and/or Ni-doped bismuth telluride of the general formula (I) or (II) Bi2-xDopuSeyTez (I) with the meaning Dop = Ge, Co, Fe, Ni or mixtures thereof u, x = independently of one another 0.001 to 0.06 y = 0.01 to 1.0 y+z = 3.00 to 3.2 Bi2-xSb yDopuSezTev (II) with the meaning Dop = Ge, Co, Fe, Ni or mixtures thereof u, x = independently of one another 0.001 to 0.4 y = 0 to 1 z = 0 to 1 z+v = 3.00 to 3.3.
Abstract translation:甲p型或n型半导体材料的步骤包括一个掺杂有锗,Co,Fe和/或Ni铋具有通式(I)或碲化物(II)的Bi-xDopuSeyTez(I)与所述的含义DOP =葛,钴,铁,镍 或它们的混合物,U,X = 0.001独立地〜0.06 Y = 0.01〜1.0,Y + Z = 3.00〜3.2的Bi-Sb的yDopuSezTev(II)与所述含义DOP =葛,钴, 的Fe,Ni或它们的混合物,U,X = 0.001独立地至0.4 Y = 0至1 Z = 0至1 Z + v = 3.00〜3.3。
Abstract:
The method for producing, processing, sintering, pressing or extruding thermoelectric materials under heat treatment using an inert gas, or at a reduced pressure at temperatures ranging from 100 to 900 °C is characterised in that the producing, processing, sintering, pressing or extruding is carried out in the presence of oxygen scavengers which form thermodynamically stable oxides under the producing, processing, sintering, pressing or extrusion conditions in the presence of free oxygen and thus keep free oxygen away from the thermoelectric material.
Abstract:
The p- or n-conductive semiconductor material contains a compound of general formula (I) Sna Pb1-a-(x1+... +xn) A1 x1...An xn (Te1-p-q-r SepSqXr)1+z in which 0.05
Abstract:
Abstract SELF-ORGANISING THERMOELECTRIC MATERIALSIn a process for producing thermoelectric maerials with a potyphasic structure, in which particles of a trst phase with a characteristic lenqth of not more than 10 pm are5 present in homogeneous dispersion in a second phase, by selfassembly, an a binary thermoelectric material is melted together with a metal which is not a componentof the at feast binarythermoelectricmeeleetrie material, or a chabogenide of said met* and, after led or bonded by reactive grinding,10 No suitable figure
Abstract:
Method for producing flexible metal contactsAbstract To produce flexible electrical and/or thermal metal contacts for connecting electrical,electronic or thermal components, metal fibers, metal fiber nonwovens or metal fiberwovens with an average fiber diameter in the range from 1 to 500 µm are compactedby rolling, pressing or extruding involving cold working to form fibrous sheets.Figure 1
Abstract:
In a method for producing thermoelectric materials with a multi-phase structure, in which particles of a first phase with a characteristic maximum length of 10 µm are uniformly dispersed in a second phase, by self-organisation, an at least binary thermoelectric material is melted together with a metal that is not a component of the at least binary thermoelectric material or with a chalcogenide of said metal and is cooled after the mixing process or is bonded by reactive milling.
Abstract:
With respect to a method for reducing the thermal conductivity and for increasing the thermoelectric efficiency of thermoelectric materials based on lead chalcogenides or skutterudites, the thermoelectrical materials are extruded at a temperature below their melting point and a pressure in the range of 300 to 1000 MPa.