Abstract:
A hydrophilic low acid content resin includes a polymerization product of a mixture including at least one (meth)acrylate and at least one (meth)acrylic acid; wherein the resin is water soluble; and the resin exhibits an acid value from 0 to about 120.
Abstract:
A chelating agent comprises a polyoxazoline. The polyoxazoline has formula A: (formula A), where R is H; F; CI; Br; I; CN; NO2; an organic group having from 1 to 20 carbon atoms; an amino group; or an oxazoline, and n is from about 2 to about 300. The polyoxazoline also has a weight average molecular weight of from about 1,500 to about 30,000.
Abstract:
Styrenic (meth)acrylic oligomers that are prepared at lower temperature than conventional solid grade oligomers, or are hydrogenated, contain fewer terminal vinylic unsaturations, when compared to such conventional styrenic (meth)acrylic oligomers prepared by the customary high temperature processes. Styrenic (meth)acrylic oligomers that contain fewer terminal vinylic unsaturations demonstrate improved thermal stability and may provide improved resistance to UV weathering compared to the conventional and non-hydrogenated styrenic (meth)acrylic oligomers.
Abstract:
A reactive hot melt adhesive has a glass transition temperature of from 45° C. to 100° C. The reactive hot melt adhesive includes the reaction product of: an isocyanate component and an isocyanate reactive component chosen from a polyester, a polyether, and combinations thereof. The isocyanate component and the isocyanate reactive component react in the presence of a styrene acrylic resin that is free of hydroxyl functionality and that is the reaction product of 60 to 80 wt % of one or more monomers chosen from C1 to C20 alkyl acrylates and methacrylates and 20 to 40 wt % of one or more monomers chosen from vinylaromatics having a vinyl moiety having 2 or 3 carbon atoms.
Abstract:
Styrenic (meth)acrylic oligomers that are prepared at lower temperature than conventional solid grade oligomers, or are hydrogenated, contain fewer terminal vinylic unsaturations, when compared to such conventional styrenic (meth)acrylic oligomers prepared by the customary high temperature processes. Styrenic (meth)acrylic oligomers that contain fewer terminal vinylic unsaturations demonstrate improved thermal stability and may provide improved resistance to UV weathering compared to the conventional and non-hydrogenated styrenic (meth)acrylic oligomers.
Abstract:
An adhesively sealed product is disclosed comprising a first surface, a second surface, and an adhesive layer bonding said first surface to said second surface; said adhesive layer comprising a copolymer and a protective colloid, the copolymer being derived from monomers including one or more a C1 to C20 alkyl(meth)acrylates and having a glass transition temperature (Tg) of from −40° C. to 0° C. using differential scanning calorimetry (DSC), wherein opening the product by separating the first surface from the second surface results in adhesive failure of the adhesive layer thereby resulting in a reclosure adhesion of less than 0.5 N/15 mm. A method of producing an adhesively sealed product is also disclosed.
Abstract:
A process for preparing a polyoxazoline includes feeding continuously an oxazoline, a solvent, and a catalyst to a continuous stirred tank reactor at a rate which provides for a residence time sufficient to achieve ring opening of the oxazoline and polymerize the oxazoline; exiting a polyoxazoline solution from the continuous stirred reactor, the polyoxazoline solution including polyoxazoline, solvent, and, optionally, unreacted oxazoline, low molecular weight oligomeric oxazoline, or a mixture thereof; removing the solvent, and, optionally, unreacted oxazoline, low molecular weight oligomeric oxazoline, or a mixture thereof from the polyoxazoline solution; and recovering the polyoxazoline.
Abstract:
A hydrophilic low acid content resin includes a polymerization product of a mixture including at least one (meth)acrylate and at least one (meth)acrylic acid; wherein the resin is water soluble; and the resin exhibits an acid value from 0 to about 120.