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公开(公告)号：AU2010264870A1
公开(公告)日：2012-01-19
申请号：AU2010264870
申请日：2010-06-18
Applicant: BASF SE
Inventor： KLEINE JAGER FRANK , HERMES STEPHAN
IPC: H05K3/12
Abstract: The invention relates to a method for producing a structured electrically conductive coating on a substrate, wherein at first a monolayer or oligolayer of a surface-hydrophobizing substance is applied onto a surface of the substrate, and subsequently a substance containing electrically conductive particle is applied to the substrate in accordance with a predetermined pattern. The invention further relates to a use of the method for producing solar cells or printed circuit boards, and to an electronic component, comprising a substrate, onto which the structured electrically conductive surface is applied, wherein a monolayer or oligolayer made of a surface-hydrophobizing material is applied onto the substrate, and the structured electrically conductive surface is applied onto the monolayer or oligolayer.
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公开(公告)号：AU2011216964B2
公开(公告)日：2015-07-09
申请号：AU2011216964
申请日：2011-02-16
Applicant: BASF SE
Inventor： KLEINE JAGER FRANK , KACZUN JURGEN , HERMES STEPHAN
Abstract: The invention relates to a process for producing electrically conductive bonds between solar cells, in which an adhesive comprising electrically conductive particles is first transferred from a carrier to the substrate by irradiating the carrier with a laser, the adhesive transferred to the substrate is partly dried and/or cured to form an adhesive layer, in a further step the adhesive is bonded to an electrical connection, and finally the adhesive layer is cured. The invention further relates to an adhesive for performing the process, comprising 20 to 98% by weight of electrically conductive particles, 0.01 to 60% by weight of an organic binder component used as a matrix material, based in each case on the solids content of the adhesive, 0.005 to 20% by weight of absorbent based on the weight of the conductive particles in the adhesive, and 0 to 50% by weight of a dispersant and 1 to 20% by weight of solvent, based in each case on the total mass of the undried and uncured adhesive.
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公开(公告)号：AU2011216964A1
公开(公告)日：2012-09-06
申请号：AU2011216964
申请日：2011-02-16
Applicant: BASF SE
Inventor： KLEINE JAGER FRANK , KACZUN JURGEN , HERMES STEPHAN
Abstract: The invention relates to a process for producing electrically conductive bonds between solar cells, in which an adhesive comprising electrically conductive particles is first transferred from a carrier to the substrate by irradiating the carrier with a laser, the adhesive transferred to the substrate is partly dried and/or cured to form an adhesive layer, in a further step the adhesive is bonded to an electrical connection, and finally the adhesive layer is cured. The invention further relates to an adhesive for performing the process, comprising 20 to 98% by weight of electrically conductive particles, 0.01 to 60% by weight of an organic binder component used as a matrix material, based in each case on the solids content of the adhesive, 0.005 to 20% by weight of absorbent based on the weight of the conductive particles in the adhesive, and 0 to 50% by weight of a dispersant and 1 to 20% by weight of solvent, based in each case on the total mass of the undried and uncured adhesive.
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